Hi all,
brand new to this so still in learning stages.
I have been researching gold recovery of computer parts, but I have a different application and have not found any forums regarding gold plate applied directly to nickel.
I have a lot of gold plated elements that are at my disposal. I accessed what I suspect is the patent, and from what I can gather the plating is specified to be 24k gold plate, no less than 10 microinches with an RA of 15 microinches or less. The plating is the finished layer, and is applied to a sub layer of bright nickel which is around 200 microinches, then a base layer of strike nickel.
While I realize the plating is not a thick plate, the diameter of the finished rod is around the diameter of a #2 pencil, and if unlooped would total around 40 inches in length per each unit.
It is for all intents and purposes a heating element, so has electrical current carrying capabilities.
My question is, since it is only plating removal of something that is set up for conducting electricity already, would there be a way remove the plating without having to dissolve all of the nickel in the process?
I am not a chemist by any stretch, and am nervous about chemicals, so the less caustic solution I can find the better, although I realize it's hard to make an olmlette without breaking a few eggs along the way.. AR technique puts a whole lotta fear into me.
Add to that, the overall length of the material is much different than fingers and pins and pcb's , and I am only dealing with a plated surface only to remove from a nickel underlay instead of dissolving computer parts to get to the gold plate?
I read a lot about reverse electroplating, would that be the best path? Considering I have a way to conduct current/heat; if so, is there a way to do it en mass in a container larger than a beaker that would fit a third of the length of what I am dealing with? Or should I just chop it up?
Any other suggestions on methods or similar applicational experience??
Pic attached.
Thanks for any advice..
Driver 8
brand new to this so still in learning stages.
I have been researching gold recovery of computer parts, but I have a different application and have not found any forums regarding gold plate applied directly to nickel.
I have a lot of gold plated elements that are at my disposal. I accessed what I suspect is the patent, and from what I can gather the plating is specified to be 24k gold plate, no less than 10 microinches with an RA of 15 microinches or less. The plating is the finished layer, and is applied to a sub layer of bright nickel which is around 200 microinches, then a base layer of strike nickel.
While I realize the plating is not a thick plate, the diameter of the finished rod is around the diameter of a #2 pencil, and if unlooped would total around 40 inches in length per each unit.
It is for all intents and purposes a heating element, so has electrical current carrying capabilities.
My question is, since it is only plating removal of something that is set up for conducting electricity already, would there be a way remove the plating without having to dissolve all of the nickel in the process?
I am not a chemist by any stretch, and am nervous about chemicals, so the less caustic solution I can find the better, although I realize it's hard to make an olmlette without breaking a few eggs along the way.. AR technique puts a whole lotta fear into me.
Add to that, the overall length of the material is much different than fingers and pins and pcb's , and I am only dealing with a plated surface only to remove from a nickel underlay instead of dissolving computer parts to get to the gold plate?
I read a lot about reverse electroplating, would that be the best path? Considering I have a way to conduct current/heat; if so, is there a way to do it en mass in a container larger than a beaker that would fit a third of the length of what I am dealing with? Or should I just chop it up?
Any other suggestions on methods or similar applicational experience??
Pic attached.
Thanks for any advice..
Driver 8