Hi,
Article comparing different surface finishing. One can find some numbers of ENIG or NiPdAu plating thicknesses there.
I think there are some errors in Table 1, it is said "1.0 μm" and "3.0 μm" next to Pd thickness. Later in the article it becomes clear that it should be "0.1 μm" and "0.3 μm".
After reading this article i am making a guess, that NiPdAu finishing is used in devices that demands more shock resistance, like mobile phones, maybe PDA's. If i am right, it would mean that Pd is not only in MLCC, but also some on the board, under Au... What do YOU think ?
found here:
http://www.atotech.com/fileadmin/pd...n_of_Pb-free_BGA_Solder_Joint_Reliability.pdf
There are some other interesting articles containing data about wire bonding, surface finishing etc.
Sorry, English is not my first language.
Article comparing different surface finishing. One can find some numbers of ENIG or NiPdAu plating thicknesses there.
I think there are some errors in Table 1, it is said "1.0 μm" and "3.0 μm" next to Pd thickness. Later in the article it becomes clear that it should be "0.1 μm" and "0.3 μm".
After reading this article i am making a guess, that NiPdAu finishing is used in devices that demands more shock resistance, like mobile phones, maybe PDA's. If i am right, it would mean that Pd is not only in MLCC, but also some on the board, under Au... What do YOU think ?
found here:
http://www.atotech.com/fileadmin/pd...n_of_Pb-free_BGA_Solder_Joint_Reliability.pdf
There are some other interesting articles containing data about wire bonding, surface finishing etc.
Sorry, English is not my first language.
