I was privileged to tour several IC mfg and packaging operations at Intel, AMD, AMS, Nat'l Semiconductor, and other Silicon Valley IC companies back in the early to mid 70s. These companies were my customers. I had developed a method of taking their reject assembled packages, usually in the form of the photo above, removing the lid and chip, selectively stripping the brazes and plating from the package without damaging any other areas, such as the Ag/Cu braze holding the legs on, and replating the gold. These customers then took these reconditioned packages, mounted a new chip in them, and sold them as brand new assemblies. I most likely reconditioned some packages identical to the one in the photo, although most I did were 40 leads. I could care less what chips they contained. I was only interested in the packages. I haven't changed. The package is where the gold is, not the chip. Screw the chip. I'm a refiner with zero interest in the electronics and I'm too damned old to change.