Gold Corner BGA Bond-Wire Visualization

[Quiklearner]

Hi All,

I came across this short video of a laser being used to expose the gold bond-wires in the epoxy package. I thought it might help anyone new to see where the gold is in these ICs.

 

[MicheleM]

There are simpler means:

 

[Quiklearner]

Good Dremel work Michele ;-)

 

[Martijn]

Why would you want to know besides curiosity? The silicon chip is in the center, legs are as long as possible towards the chip. Bonding wires are in between those two points.

A hammer also works fine for that.
This laser was also suggested to count the number of wires some time ago.
Spoiler: same number of wires as there are legs.

Taking the chips apart before incineration is a lot of work. I've seen a post of a member with a method where the chip is scored on both sides with a grinding disk to break off the legs and leave the wires inside. That will save on a lot of processing and separating, but also takes time to process each chip individually and produces harmfull dust.

 

[Quiklearner]

As you say Martijn, purely out of curiosity... I was in no way suggesting to process these chips in this manner.

 

[Hombressino]

Two links - similar topic:
https://zeptobars.com/en/read/how-to-open-microchip-asic-what-insidehttps://hackaday.com/2012/08/13/taking-a-look-at-decapped-ics/