goldmelts
Well-known member
HI Steve,
I was actually refering to the top lid. I can easily remove the bottom, but don't have a torch to remove the top lib.
So, I remove the bottom, leave the top. I'm assuming after some time the solder holding the top lid is removed, and then it's a good idea to remove the top lid from the mix. Is this correct?
will the disolved tungsten copper alloy cause an issue with the cleaning stage? or with the AP process? How would you wash the gold with the tungsten alloy? same as usual (hot HCl and water)?
I was actually refering to the top lid. I can easily remove the bottom, but don't have a torch to remove the top lib.
So, I remove the bottom, leave the top. I'm assuming after some time the solder holding the top lid is removed, and then it's a good idea to remove the top lid from the mix. Is this correct?
will the disolved tungsten copper alloy cause an issue with the cleaning stage? or with the AP process? How would you wash the gold with the tungsten alloy? same as usual (hot HCl and water)?