- Joined
- Jan 18, 2010
- Messages
- 141
Recently got my hands on alot of 1950's military aerospace boards. The fingers are so heavy you can really feel their thickness. There is alot of gold on these boards. I've tested. The wiring from fingers and to all other points on the board are thick. The board reads "Autonetics U S. There is nothing on these boards but the fingers, wiring and solder.
I am thinking to submerge complete board in AR: perhaps I'll cut it into pieces. It is 2 1/2" x 8" in size at present.
I have been conducting Steve's peroxide solution on another pound of cut fingers from a modern day computer. Unfortunately, they have been soaking in that solution for 6 days with very little sign of fingers falling off. I agitate twice a day and have added peroxide to muratic twice. So I wish to research AR as option. I live in CT and we have been in the mid 20 - 30s this last week so I do recognize this as a variable slowing down the process
Regardless, my question is, if I dissolve in AR, how do I deal with the removal of lead and tin from Gold solution?
I started Hoke's book Friday evening and am really engrossed but there is no addressing of solder.
I am open to suggestion
I am thinking to submerge complete board in AR: perhaps I'll cut it into pieces. It is 2 1/2" x 8" in size at present.
I have been conducting Steve's peroxide solution on another pound of cut fingers from a modern day computer. Unfortunately, they have been soaking in that solution for 6 days with very little sign of fingers falling off. I agitate twice a day and have added peroxide to muratic twice. So I wish to research AR as option. I live in CT and we have been in the mid 20 - 30s this last week so I do recognize this as a variable slowing down the process
Regardless, my question is, if I dissolve in AR, how do I deal with the removal of lead and tin from Gold solution?
I started Hoke's book Friday evening and am really engrossed but there is no addressing of solder.
I am open to suggestion