kurtak
Well-known member
Just wondering if anyone has processed the IC chips from RAM Bus --- RAM Bus is the RAM with the aluminum shield/heat sink riveted over the IC chips
Here is a pic with the aluminum shield removed
I don't remember them ever being discussed for processing for gold bond wires
They are BGA type ICs
But unlike regular RAM BGAs they don't have the epoxy on top of the silicon chip
However - they still have gold bond wires
The bond wires are in the little epoxy ribbon in the center of the chip on the ball grid side of the chip --- just like where the bond wires are in regular epoxy coated RAM BGAs
Might be a good one for Alex (Troax) to try in his thread about data of "particular" types of chips 8) :mrgreen:
Kurt
Here is a pic with the aluminum shield removed
I don't remember them ever being discussed for processing for gold bond wires
They are BGA type ICs
But unlike regular RAM BGAs they don't have the epoxy on top of the silicon chip
However - they still have gold bond wires
The bond wires are in the little epoxy ribbon in the center of the chip on the ball grid side of the chip --- just like where the bond wires are in regular epoxy coated RAM BGAs
Might be a good one for Alex (Troax) to try in his thread about data of "particular" types of chips 8) :mrgreen:
Kurt