Looking for some advice like always I'm wondering if I should use AP on these or ar or AP then AR? Let me know guys. I'm just not sure what the plastic and the circuit board still attached if AR would be the best method. Which is the method I would normally go for with CPUs with the gold-plated pins attached. I don't know. Right now I'm boiling with HCL because it has solder on it. So I'm looking to get that off. I have a container with HCL that I use specifically for boiling off the solder off of things. So after a couple of rinses I'll be ready to implement whatever method my fine gold refining forum friends advice thank you!
AP or AR?
- Thread starter Rreyes097
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