Newbie from Bangladesh

[prince]

Hi, This is Tutul from Bangladesh, I'm new to Gold Recovery, but I've been thinking about it for 2-3 years.I want to take it as a profession.I basically want to work with mobile computer LED TV boards, From there IC and interested in refining gold from gold plated objects. I worked on mobile and computer boards a few days ago, but I didn't succeed. Because of the presence of other metals in the gold foil shots. I did not use the AP method. I used nitric and water methods. To separate the foil shots. If any of you have a complete method, you can give it to me. I hope you will benefit. And one more thing, this group is very helpful. Be good to everyone. Thanks, everyone

 

[Martijn]

Welcome to the forum Tutul,
Start with learning about safety and how to deal with waste.
We are dealing with toxic chemicals here and these need to be handled and disposed of with care.

Dealing with waste:
Dealing with Waste
study hard and only try small tests on a little bit to learn after you ask here.
While you are studying, remove all metal like iron and aluminum from the boards and cut the plated parts off without any solder. The plated finger contacts can go in AP.

The LCD screen boards, if you want to try the very thin plating on them, need to be leached in HCL to remove solder and can then go in the AP if all components are loosened by the HCL.
Small cellphone boards and such can be cleaned like that. You can pick the IC' and MLCC'S out later. If you haven't yet pried them off with a chisel.
Some go straight to AP without the HCL step. But then you end up with components and plastic mixed with gold foils.
Again there is very little gold there.
The most is in the IC's, transistors and some in LED's. And some on the contact fingers.

A good thread about AP:
Acid Peroxide Process Information Thread Q & A's

The Cupric Chloride Etch chemistry explained:
https://sparks.gogo.co.nz/seychell.pdf
Guided tour to the forum:
Welcome to all Newbies

You have a lot of reading to do.
Have fun!

Martijn.