- Joined
- Mar 13, 2012
- Messages
- 315
I have read many times here on the forum about metastannic acid creating problems during the refining process. Can anyone expain to me what type of problems occur with metastannic acid other than slow filtering when processing gold from say cell phone boards, and/or other boards which contain solder. Does metastannic acid reduce yields? When I process 'solder boards' in nitric I end up with a lot of this gray/silver colored stuff mixed in with the foils. I clean this up with HCL. I then end up with some pretty clean foils that have mixed in with them some brownish, kind of fluffy small particulate material. Is this brown material the dreaded metastannic acid? And if so, could this be prevented by removing the solder with dilute HCL prior to processing with nitric to remove foils? If I am thinking correctly I need to first depopulate the boards, then remove the solder in dilute HCL, then remove foils with nitric, then incinerate foils to deal with metastannic acid, and then dissolve foils in poor mans AR. Does anyone care to share their ideas for processing boards with solder on them? At this time I have some boards in dilute- 3/1 - HCL to remove solder. I will process these and see if I get any of that brown fluffy stuff mixed with the foils. By the way, this brown fluffy stuff does not seem to dissolve in HCL/Cl, which through a search on the forum seems to be the case with metastannic acid. Thanks in advance.