That won’t affect anything?Hydrochloric acid.
So if it forms a silver chloride use sulfuric acid to bring it back to state?Hydrochloric acid is not a good idea. It will form silverchloride and create hard to remove tin compounds.
If (!) then I use dilute sulfuric acid ( max 5%) and give it some time and a warm spot to work.
I'm a bit confused of what you are suggesting.Hydrochloric acid is not a good idea. It will form silverchloride and create hard to remove tin compounds.
If (!) then I use dilute sulfuric acid ( max 5%) and give it some time and a warm spot to work.
Thank youI'm a bit confused of what you are suggesting.
HCl won't touch the silver much and it is minute amounts anyway in solder.
It will however dissolve the tin completely and as far as I know do not leave residue.
Nitric on the other hand should not be close to tin, since it forms a compound called stannic acid
which is a form of tin oxide which is a nightmare to filter.
Jbooth you have been given good advice, read the book of C.M. Hooke
and search the forum before you continue your chemical endeavor.
Se for ácido clorídrico bem diluído pode funciona, funcionou comigo. Nas placas de celulares, retirou grande parte do estanho.O ácido clorídrico não é uma boa ideia. Ele formará cloreto de prata e criará compostos de estanho difíceis de remover.
Se (!), então eu uso ácido sulfúrico diluído (máximo de 5%) e dou algum tempo e um local quente para trabalhar.
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