Hello everyone
I have gathered some different types of e-waste and planning to start experimenting with it. I have done my home work and written some notes so that i develop the most beneficial, economical and safest way to process them But still there are some points that im not certain about and kindly seeking your help with them.
After sorting my e-waste i ended up with:
Connecter pins ( from RAM's, GPU's and modem cards)
Flatpacks 2S thin ( RAM and GPU )
Flatpacks 4S thin ( modem and motherboards)
Large BGA chips from motherbords
For the IC's:
Well wet ashing is not even an option as it is extremely dangerous and hazardous ( I dont know why some people do it with no regard to there own heath ! ). So I am planing to incinerate them and crushing them ( in a gashood as the fiber powder is highly corrosive to the lungs)
After that i will proceed to dissolving the base metals in HNO3 solution ( which in a later step i will recover silver from it )
The third step will be AR ( HCL/HNO3 )
Then precipitating the gold with SMB
In the end refining the gold to the finnest state i can
Same steps will be applied for the gold fingers ( without incinerateing them)
Note: all process are done in a filtered gashood
My method of separating the IC'S is by using a knife and im planing in the future to buy a heatgun but not yet because i dont have enough space in the gashood and im aware that heating the solder also produces toxic fumes that am not happy dealing with now
My questions that i kindly ask for help with are:
1- after dissolving the base metals if i used a copper rod to precipitate silver im expecting to precipitate all the metals that are lower in the reactivity series which are by order ( tungesten, mercury, silver, gold, and platinum )
And knowing that AP does not dissolve gold or lower im expecting high purity of silver. My question is what are the contaminates that i should expect and what methods should i use to eliminate them ?
2- what changes are introduced when i use a heatgun instead of a knife as a method to removing IC's
3- by not removing the whole solder and the IC's legs im expecting to use more HNO3 as there are more base metals present. Is that the only thing i should expect?
My greetings to moderators, members and everyone here
Please excuse my English and i happy for any corrections to be made
Abdulkader
I have gathered some different types of e-waste and planning to start experimenting with it. I have done my home work and written some notes so that i develop the most beneficial, economical and safest way to process them But still there are some points that im not certain about and kindly seeking your help with them.
After sorting my e-waste i ended up with:
Connecter pins ( from RAM's, GPU's and modem cards)
Flatpacks 2S thin ( RAM and GPU )
Flatpacks 4S thin ( modem and motherboards)
Large BGA chips from motherbords
For the IC's:
Well wet ashing is not even an option as it is extremely dangerous and hazardous ( I dont know why some people do it with no regard to there own heath ! ). So I am planing to incinerate them and crushing them ( in a gashood as the fiber powder is highly corrosive to the lungs)
After that i will proceed to dissolving the base metals in HNO3 solution ( which in a later step i will recover silver from it )
The third step will be AR ( HCL/HNO3 )
Then precipitating the gold with SMB
In the end refining the gold to the finnest state i can
Same steps will be applied for the gold fingers ( without incinerateing them)
Note: all process are done in a filtered gashood
My method of separating the IC'S is by using a knife and im planing in the future to buy a heatgun but not yet because i dont have enough space in the gashood and im aware that heating the solder also produces toxic fumes that am not happy dealing with now
My questions that i kindly ask for help with are:
1- after dissolving the base metals if i used a copper rod to precipitate silver im expecting to precipitate all the metals that are lower in the reactivity series which are by order ( tungesten, mercury, silver, gold, and platinum )
And knowing that AP does not dissolve gold or lower im expecting high purity of silver. My question is what are the contaminates that i should expect and what methods should i use to eliminate them ?
2- what changes are introduced when i use a heatgun instead of a knife as a method to removing IC's
3- by not removing the whole solder and the IC's legs im expecting to use more HNO3 as there are more base metals present. Is that the only thing i should expect?
My greetings to moderators, members and everyone here
Please excuse my English and i happy for any corrections to be made
Abdulkader