hammerdown
Well-known member
- Joined
- Sep 21, 2019
- Messages
- 77
I just want to make sure I'm understanding the basic underlying principal jist of AP & AR in regards to clean plated boards & card fingers.
AP is initially used to remove the gold plating/flashing from the nickle and copper substrate of the PCB that it was bonded to during fabrication, creating a copper leach as some say... correct? Of in which that AP is now more accurately called CuCl2 that can be used over & over again for repeated recovery processing. Then, after recovering & washing the foils/particles, process through AR (or HCL/CL) to dissolve the recovered gold alloy to seperate from the impurities within the gold alloy so that pure gold can be persipitated out & recovered, which appears to just be a suped up AP process so that gold too can be dissolved... correct? So, assuming my jist understanding is somewhat on point, then why not just skip the AP / CuCl2 recovery step and place the clean boards (no solder, components or iron contaminants) and/or fingers right into AR? Would it be due to the usual nickle layer between the gold & the copper substrate as a wanted avoidance that could hinder the AR recovery?... The solder mask material possibly getting dissolved as well further complicating matters?
As mentioned before, I am not necessarily looking to cut corners or whatever to be impatient or rushed, but rather trying to better under why waste time with what appears to be an unnecessary step where the 2nd step sounds like it would pretty much elimenate the need for the 1st step for this type of material. I have yet to evolve past my experience past the CuCl2 leech recovery process with PCB gold plated material, but just often wondered why bother when the AR or HCL/Cl step appears to combine both steps 1 & 2 into 1 single step. I do so apologize if this has been addressed before. I do try to use the forum search.
AP is initially used to remove the gold plating/flashing from the nickle and copper substrate of the PCB that it was bonded to during fabrication, creating a copper leach as some say... correct? Of in which that AP is now more accurately called CuCl2 that can be used over & over again for repeated recovery processing. Then, after recovering & washing the foils/particles, process through AR (or HCL/CL) to dissolve the recovered gold alloy to seperate from the impurities within the gold alloy so that pure gold can be persipitated out & recovered, which appears to just be a suped up AP process so that gold too can be dissolved... correct? So, assuming my jist understanding is somewhat on point, then why not just skip the AP / CuCl2 recovery step and place the clean boards (no solder, components or iron contaminants) and/or fingers right into AR? Would it be due to the usual nickle layer between the gold & the copper substrate as a wanted avoidance that could hinder the AR recovery?... The solder mask material possibly getting dissolved as well further complicating matters?
As mentioned before, I am not necessarily looking to cut corners or whatever to be impatient or rushed, but rather trying to better under why waste time with what appears to be an unnecessary step where the 2nd step sounds like it would pretty much elimenate the need for the 1st step for this type of material. I have yet to evolve past my experience past the CuCl2 leech recovery process with PCB gold plated material, but just often wondered why bother when the AR or HCL/Cl step appears to combine both steps 1 & 2 into 1 single step. I do so apologize if this has been addressed before. I do try to use the forum search.