Yellow: LED-Light Emitting Diode, potential for one solid gold bond wire and silver plated anode/cathode.
Red: Resistor network, potential for silver and PGMs, palladium and platinum most common, plated to the ceramic substrate.
White: TO-92 package style transistor, potential for 2 solid gold bond wires, precious metal plated substrate and micro chip die braze.
Orange: Axial mount resistor, rare chance for gold plated end caps and precious metal plated to the ceramic substrate.
Blue: Glass diode, potential for precious metal point bond. Solid gold and platinum alloys are common.
Purple: DIP-Dual Inline Pin array, IC-Intergrated Circuit, same potential as TO-92, one bond wire per lead.
Green: Epoxy coated MLCC-Multi Layer Ceramic Capacitor, potential for silver and palladium.
Janie
