Anything goes as long as it doesn't form a screen between the electrodes. The current have to reach the object to be deplated. There also have to be an electrical path from the copper to the object being deplated.
A copper mesh is just easy to form and doesn't create any pockets so it is easy to drain when removed from the cell.
It looks like there is several holes in your parts, I would form hooks out of copper wires and have another one going straight over the vessel for sulfuric acid and just hang it from that, that way you can prepare the next one while one or more are deplating.
Check this video and you will see what I'm trying to explain.
https://www.youtube.com/watch?v=5gCsty84VvA
I have more references collected on this page : http://goldrefiningwiki.com/mediawiki/index.php/Reverse_plating_cell
Göran
A copper mesh is just easy to form and doesn't create any pockets so it is easy to drain when removed from the cell.
It looks like there is several holes in your parts, I would form hooks out of copper wires and have another one going straight over the vessel for sulfuric acid and just hang it from that, that way you can prepare the next one while one or more are deplating.
Check this video and you will see what I'm trying to explain.
https://www.youtube.com/watch?v=5gCsty84VvA
I have more references collected on this page : http://goldrefiningwiki.com/mediawiki/index.php/Reverse_plating_cell
Göran