Search results for query: ap

...for PCB's, start with a 2 or 3 day soak in water and LYE. A bubbler in it will help as well. This will dissolve the epoxy silk screen crap, and leave about 90# of the gold traces intact Then it's into a clean bucket of rinse water Then put the PCB's in a suitable large bin with AP and...

...the solution..my stannous has gone haywire. Needs a refresh, but the process was pretty structured and with the correct materials in terms of the AP, no bubbler. Unsure why after 3rd filter have still not cleared Solution... Is this dark solution worth adding smb? Or is there a further...

...inside the traces of the PCBs at which time the Gold may be considered lost, or at least impractical to recover. If you do not have time for AP you can use Nitric first to release the foils and components from the boards. Then a sieve/coarse filter to get rid of the Metastannic acid. You...

In the AP process, a small amount of gold can dissolve, but because the gold and base metals are electrically connected, the chemical reaction goes for the base metals as the easier target. Any gold that dissolves eventually cements out on the base metals and is eventually recovered along with...

...Time was needed to sort everything, time was needed to run separate batches of sorted stuff, time was needed to thoroughly process the pins in AP. This was unacceptable for me (us), as we usually processed high grade old pins, >10g/kg Au, and if these were unsoldered and new, you can let...

If I may ask, what did the faint smell of nitric smell like to you? I am a beginner as well and I saw all of the fumes getting sucked out of my fume hood but still smelt something in the air. Almost smelt like chlorine

...and slot cards, I removed all aluminum and steel, and/or copper and heat sinks. Again heating the whole boards and knocking components into the appropriate box for later processing. Bare boards were separated into lots by gold, non plated boards separated for disposal and plated boards were...

Also - a little more about HCl + H2O2 (for better understanding) https://goldrefiningforum.com/threads/ap-questions.32347/#post-343123 Kurt

...ratio for our kind of use, use enough. For nitric mix 50/50 and cover the metal and heat it, add more whenever the reaction slows down. For AP find some corroded copper and add it to plenty of HCl start bubbling air through it. If you want a faster reaction heat it, not boil. Use plenty HCl...

I used a perforated transarent plastic pot for that reason, just to keep different materials apart and be able to wash it clean of foils in the AP. It is helpfull to be able to watch the progress and reaction, like e.g. cementing of copper on pins, indicating their reactivity.

Lino was referring to the extra .5g of gold above the 1 gram that you have paid for ($300).

I'm hoping to get a bit more than .5g as they appear to have thicker plating than avg. I was also thinking about trimming them to the point of only gold showing before they go into the AP solution

...to discharge. Last week I took half of a board and dropped it into an AR mix with no pre-treatment. I took the other half and dropped it into an AP mix with no pre-treatment. Having no prior experience with AP. Both went about as well as you'd imagine. The tin totally blew up the AR mix, and...

I created this small PVC test vessel (to drop into the same AP bucket) whereby I can determine the effect of the copper II chloride on four different items without fouling the solution. Please feel free to critique and comment.

Tha AP method will not create Metastannic acid, but it is slow. One can speed it up by doing it hot 50-70 ish C.

I've already processed some beryllium-copper alloy core pins. There doesn't seem to be any uncontrolled reaction with the way I strip base metals using the AP method. One just has to be very careful with the waste solution, since beryllium ion is so toxic.

Did you use AP, or AR? Sounds like you over dosed the Nitric, if you went the AR route. Boil to syrup, or use Sulfamic to DeNOX. If you boil to syrup, you will need to rehydrate it with HCL. This s covered many times on GFR. Research before you attempt the procedure.

No sense in inquartering gold filled. Usually it goes straight to nitric, but AP can be used.

Running fingers in AP should take no more than 4 days using only an air bubbler and copper oxide. Three under optimal conditions. If it is taking weeks or more my first suspect would be to little solution. Almost all YouTube videos show people using way too little volume of acids for the amount...

Keep your pump well above the acid level your AP bucket or get one of those Walmart check valves, they should be in the aquarium department as well.

Also. How do chloride solutions get dissolved silver if they don't dissolve silver? People extracting gold only use ap (a chloride solution), so how does the silver get in there before using ar to later refine I wonder? There should be no silver chloride around by the time one uses ar, yet I...

The Sulfuric stripping cell do not produce much waste at all if operated correctly, since it do not dissolve base metals. And if you leave the collected Gold to drip off properly in a glass fiber filter practically all the acid can be reused.

You really do not need the Peroxide for AP. Use an aquarium air bubbler.

This seems like the long way around of finding how to work with AP. But, it is the simple way and it often sticks in our minds easier. At least for some of us. Another picture will be nice when you see any major changes in the material. 👍

Yes and no... Consider our friend, the copper chloride leach (aka AP). The chloride ions combine with the copper ions from oxidized copper to create CuCl2. CuCl2 will then dissolve copper metal, creating two CuCl. Oxygen will then further oxidize the CuCl, which combines with chloride ions...

I can not say from my experience. Nitric is too costly for this use for me. But both should give that same recovery if done properly, Metastannic may pose a challenge with Nitric though

That means you have only solids dispersed in solution. Then you should stop your washes and dissolve it in the method of your choice. If you continue to “grind” down your material by friction/washing, it will be even finer. Dissolve it and drop it by SMB, Copperas or other preferred methods...

Thank you. Follow up question: Can I draw any conclusions when I process them (after depopulating of course) in copper (ll) chloride (AP) with respect to how easily the plating peeled up and did not adhere to the PC board?

Drop the “y’all” it is not proper English and do not translate well for non English speakers.

...process, specially when we thinking about ic chips value lost during washing process and gold lost or postponed to recover when use AP method (considering the possibility of dissolving some gold in AP in most cases), before couple weeks I published a post depended on an internet article...