Search results for query: ap

I made a couple vids on Rumble showing how to pop the plastic quickly off a couple types of pin arrays. Some can be tricky, depending on how they're assembled.

We all just use it I guess. If one opt for the Cupric Chloride leach, speed is not the driving factor. But warm seems faster than cold. In my world cold is below freezing, not that i process much during the coldest parts of winter anyway😏 If speed is important, most strip the potential Tin off...

...slow down, learn, think and manage my expectations. This is an exciting hobby and you guys enhance this pleasure. Last month, I mixed a batch of AP and placed several pounds of circuit boards inside the 5 gallon bucket. These boards showed high gold visibility but had lots of electronic...

...be treated according to the waste treatment procedure or handed in to a hazardous waste treatment facility. And as said before there is no need of constant bubbling unless you have HCl and Cl ions in the solution. Most of us just run a Cupric Chloride etch (AP) for the foils. Not many use...

So I found I can peel the plating on the circuit boards up saving me the hassle of removing solder and cutting up to run through ap...but it's only plating on a silver colored non-magnetic metal....anyone have any clue as to what metal it is? Am hoping it's silver but am doubtful at the same time.

Hello, the AP process is a "misnomer " for a CuCl2 (aq) . CuCl2 is able to dissolve copper and almost all base metal leaving gold foils/dust ecc. how to make CuCl2?: The simplest way is put together Cu, HCl plus an oxider such as the atmospheric oxygen. A good oxydizer is H2O2 ( from this the...

The thick foils from Gold filled may not dissolve easily in HCl/Bleach. Better with AR or at least HCl/ pool-Chlorine or strong Peroxide.

...fumes down. The fan can corrode if not resistant to the fumes. You need to learn more about recovery processes. Lots of info here Search for the AP process. If there was some of one acid left from a first leach, the second will create some weak AR and dissolve some gold. Check the...

...heat gun and a putty knife. Then soak in Hcl to dissolve all the remaining solder. (This step is important, too much tin solder dissolved in the AP solution makes a huge mess that's hard to fix. And will tie up any dissolved gold in it.) Rinse then chop up to smallish bits, (an inch or...

...method, but more efficient in regard of the yield in ratio to acid consumption. Very inefficient in regard of time. Dissolving all the pins in AP solution takes huge amounts of acid and produces too much waste for little gold. So I'am coming back to my original question, is there any other...

The above cited link is the most comprehensive paper by a hobbyist on the subject of AP/CuCl leach parameters. I actually got permission from the original author to post the document here. I strongly recommend getting an authors permission before re-posting his/her work. Despite what anyone...

...shelf life drops like a lead sinker, and the actual need for the chemical added may be a lot less then the mixture you have. Another thing is that AP is not an Acid Peroxide leach after all, it is a Copper Chloride etch/leach and it don't need Peroxide at all. It needs HCl, Copper and Oxygen...

Look into the history of AP. The original intent was to dissolve the gold. Once the gold was in solution it could then be dropped with most common precipitants. AP was later developed to make an easier method of recovering foils and flakes from gold fingers and boards by limiting the volume...

Save some of the used ap. On the next batch you add the used ap and some hcl, no peroxide needed. The used ap will kick it off 10 times faster than the hcl peroxide alone. Saves a lot of time.

As Ultrax say any of them will remove the Zinc, but since Zinc drop all the other metals including Copper. I think Nitric is your only viable solution, unless you have Tin in your Mix.

...it should show nice black positive. If it fail to make black positive stannous I wouldn´t mess with this anymore. Any kind of digestion, either in AP or straight nitric would most probably produce ultrafine gold sludge (if gold is there) which would be harder to process and separate via...

Same history, the big boys shred and smelts before electrolytic refining. AP or Nitric will give you most of the foils from the boards, even though it may be way less than you think. It can go straight into AP but needs a few hours in full strength HCl to get rid of the Tin if you go for Nitric...

OK, so, would you believe that I had the exact thing happen to me and I did almost the exact things you did and the outcome was almost the exact. I DID however take pictures and videos. I'm going to attach a picture of my solution after I put some on my spoon for testing..I'm hoping I will be...

...backyard refiner who has been at this for only less than a decade, and who has only recently begun tinkering with a few ores - nothing magical happened to my brain when I turned 18 that caused me to stop making dumb mistakes. The first acid-peroxide recovery I ever did a decade back began in...

Its really not green, but i could be color blind ;) Its very blue... :( maybe a bit of silver ye think?

Hi Thanks for the book "heads up". I basically made an AP Vinegar and peroxide for some circuit boards fingers waited 4 weeks then filtered. I added some HCL then filtered again. The first filter without hcl produced a series of colours in respect to filtered material... This is pre SMB. I was...

The AP should not have values in them unless there is some exposed Pd, and even then very little. Store it in a waste bucket and when it is getting 3/4 full, put in a Copper bar and stir/bubble air for a day or two and then remove the copper, making sure you brush off any blacks into the...

...to a well ventilated area preferably outside or under a fume hood. The gases from HCl will start to destroy any exposed metal in its vicinity. The AP solution(Copper Chloride etch) don't need to be disposed of you keep it for the next round of leaching. Better use air bubbling in stead of...

...2:1 Muriatic: Peroxide. It's the gas that dislodges the gold from the flux and although chemically it's not dissolved, it is absorbed into the AP mix . I can do several loads in the same bucket, refreshing with a cup of Muriatic and half cup of peroxide, (always a 2:1 ratio) and just cover...

...later, I do want to save the sillicon aswell. I initially wanted to test the two telecom-grade PCBs foils, which most were probably dissolved in AP, but since they been in that filter for so long and these been here for nearly a year (note I removed the chips from each CC individually then...

I also think, the pins were high quality/thick plated (medical, military or very old). The AP was unable to penetrate the plating. Cutting the pins in three pieces would have opened the brass core for the AP. Now you might have a gold-copper alloy of about 12k and the AP can't attack it. You...

...cut my waste acid volume in half! The copper chloride/copper sulfate in the pin dissolve also is easily processed. The mixture of the two salts appears to cement copper onto iron very swiftly. It will be interesting to test this waste acid mixture on kovar core pins when I do my CPU stuff.

...enough confidence in myself, and the right set up to do my experiments, so I built me a little hood got some finger cards started with 80 g the AP process without the P marantic, acid with the air bubbler works great after 48 hours. I was seeing the gold coming off the cards so I made some...

The AP is one of these processes, there may be others though. So if anyone has something, please keep it coming.

That white plastic becomes a real mess in AP. It starts to break down in a sticky goo.