Search results for query: ap

Yes, they will both dissolve Copper, plain HCl will not though and it will dissolve the Nickel, but maybe not fast enough to avoid AP though. If it is indeed Copper, one can use a Sulfuric stripping cell which will leave the Copper behind.

If you want to find out, you need to crush it to a fine powder and pan it. That will reveal if there are larger particles of Gold. Or the best way, crush it finely and either send it for an assay or smelt it and cupel it.

There are situations when plating has been covered by some kind of coating. So one of the good advice practice by some of our gurus and present members is to roast/heat anything to be refined to red glow. This will take care of oils and such.

Didn't work for me. Lots of silver chloride formed. Tried to melt as is, big mess...

Let me apologize for my careless words. I was calling them foils because some of what I put in was foils I had from an AP solution that I have on a bubbler and I every couple weeks I filter it for the foils. And lots of the gold has also come off most of the material that's in there. So I have...

I looked this up and got quotes on this

The AP hasn't been refreshed with HCL. I did add some hydrogen peroxide before i left it overnight, however. I'll try a bubbler and give the pins a week to see if there is any noticeable reaction

...air for better reaction between HCl and tin and reaction was running for an hour and a half. But I'm a little confused, if HCl and air can dissolve gold how AP process can dissolve base metals without dissolving any of gold? And in this case how can I get the gold ut of my solution? Thanks...

Welcome to the forum. I think the easiest and safest process to start learning this craft is AP, short for Acid Peroxide. Its a copper chloride leach process that slowly eats away copper underneath plated gold so it releases from the curcuit board or pin. You can filter out the gold foils and...

Thanks for the answer!

...on trying to make something out of it when I still have other raw material to refine. You are correct - the pins are all stripped down from scrapped mil components. This evening I am trying to remove all of the pins from the epoxy thats holding them. I would like to dissolve them in AR...

These are a real pain, the pins are all on an angle and they do not like to be pried on, using a stiff metal putty knife works really well on regular boards as you can cut right through the pins at the bottom of the connector along the board, but these are much stiffer base metal and they twist...

...always gives too much free Nitric. Next it seem you put whole boards in, which is another mistake. We cut off the Gold plated parts and use either AP or plain Nitric to remove the base metals so the foils are liberated. We then dissolve the foils in a solution of HCl by adding Nitric on a...

After replying I had a second look at your material, some of this I think is better incinerated, cleaned/washed and dissolved directly in AR, HCl/Peroxide or similar. Hence the reason for proper separation.

thanks for the detailed answer. I can't work with nitrogen because of the settlement, I prefer AP and hcl+bleach. I did this cooking in hcl far in nature outside the settlement. now I do what's left cold. ok, I always use 16-20% HCL processes and it works perfectly. I think the transistors are...

An AP leach will be fast on this kind of powdered copper, making the Gold and possibly Silver accessible for a more targeted smelt or leach.

...control boards. One hard and white plastic, like in his picture. The other a softer, slightly transparent plastic. Both went just fine in my AP process. But give it a try with one connector in a small cup. See for yourself. Prying the plastic off, while keeping the pins on the board is the...

I was following an expired patent to make gold electrolyte for electro forming. I started with AP and 20 grams pure gold powder. It went into solution as planned. Next step was to add ammonia to get a precipitate. This went as planned too. I added ammonia until the resulting liquid tested...

If you're sure the base metals are completely dissolved, then that foil is gold. To check, you can always wash a piece very well in distilled water (to make sure no chlorides remain) and then drop it in 50% nitric. If it sits there for a day and nothing happens, GOLD!

...I have found from older mobiles were plated, except these brown and yellow flexible pads. These are mostly ENIG plating so you can drop them in AP and just forget it. You will have to process a large amount of foil type keypads for a significant amount of gold. I only process these when I...

Yes, but that will also take the Copper. HCl will take only the Tin.

...not usually used on whole boards. One reason is that most of the Copper is inside in the traces, besides the Tin and other metals will reduce the effectiveness of the AP leach. We usually use it solely on fingers and other plated parts of the boards after the Tin and other components are removed.

A tiny amount of silver can be dissolved in a strong chloride solution. It's why we dilute AR and filter it before dropping gold. Silver usually gets into AR because a small amount has remained allowed with the gold. When the gold is dissolved, the silver can dissolve as well. Dave

I'm less concerned by the temporary loss of Gold, than the fact that you seem to lack order and system in the lab. With other chemicals that can lead to everything from splashes gases and injuries. Another thing is that your AP do not need H2O2 at all, just oxygen, so an air bubbler will fix that.

Thanks Dave, I've read exactly this regarding pins, but just wanted to ask before I get things started off in case there are things that I could be adding to my AP bucket with the fingers and other Gold bearing board trimmings. Appreciate you responding to me so quickly in any case, thank you.

Some search terms to look into…… AP, CuCl2, copper chloride, these three, when doing a search of this forum, will be an overwhelming amount of information to try and consume. They all mean the same thing but produce different results. Also check into copper 2 chloride. Same stuff, different...

Hi, If you are processing a lot of boards, no matter how hard it sounds, mechanical is the best way to separate. I am making a drum separator using an old washing mschine with which i want to reclaim the solder and components, since solder conteins silver and some dissolved gold from the...

You will not get all Gold by AR, you will dissolve all Gold, but some to much will cement out inside the PCB. Do you use an air bubbler in your AP?

HCl + H2O2 is a refining process, not meant for pins and pcb's. The base metals will cement out any dissolved pm's. AP or Cu2Cl leach is needed before that step. Or some other process. Do as Yggdrasil said. It can save your life. Start reading Hoke's book. Martijn.

i have a last quastion, in the first place i take my gold plated pins and mixed with hydrochloric acid and way too much hydrogene peroxyde, after that a black powder fomed. I filtered it and when i process it with hydrochloric acid and bleach the black powder was still here. Have i lost the gold...