Hi there, so i'm in nothing but doubts right here, what would be best way to start processing PCBs? Like motherboards and such from a grade to another, my main plans are on telecom grade, RAM sticks and HDD PCBs from under it.
I had settled for copper chloride for a while but seems it would only work well when it only deals with copper? There is with certainity a lot of variety of metals in there-
I really need to start making a test batch and see the yield because I could potentially get a lot of them.
I want each single bit of metal from the boards like copper or tin not willing to separate the IC's and such but rather do it thru a whole process.
Would a solution of copper chloride work to get rid of all the base metals including copper and maybe silver and leave only gold and plastic behind?
My main plan right now would be get the boards on a recipient and cover with hcl and h2o2, after it get's going I get a bubbler in to not mess with the gold.
Really wondering how i'm separating base metals as I want these pure and if i can take much advantage of the reactivity series table.
I really dislike the idea of pyrolisis as it will surely make a lot of noxious smoke, however, wouldn't it be more effective to just pyrolize the pcb's as a whole ? I know some things can explode upon heating and tin would make a mess at the bottom too.
I remember there was a solution that would remove external layers on PCBs and leave the copper surface visible and clean, that would certainly speed up the process and perhaps even exempt me from using pyrolisis (on the boards i actually want to work with) but I haven't saved the data.
Any advice, recommendation?
I had settled for copper chloride for a while but seems it would only work well when it only deals with copper? There is with certainity a lot of variety of metals in there-
I really need to start making a test batch and see the yield because I could potentially get a lot of them.
I want each single bit of metal from the boards like copper or tin not willing to separate the IC's and such but rather do it thru a whole process.
Would a solution of copper chloride work to get rid of all the base metals including copper and maybe silver and leave only gold and plastic behind?
My main plan right now would be get the boards on a recipient and cover with hcl and h2o2, after it get's going I get a bubbler in to not mess with the gold.
Really wondering how i'm separating base metals as I want these pure and if i can take much advantage of the reactivity series table.
I really dislike the idea of pyrolisis as it will surely make a lot of noxious smoke, however, wouldn't it be more effective to just pyrolize the pcb's as a whole ? I know some things can explode upon heating and tin would make a mess at the bottom too.
I remember there was a solution that would remove external layers on PCBs and leave the copper surface visible and clean, that would certainly speed up the process and perhaps even exempt me from using pyrolisis (on the boards i actually want to work with) but I haven't saved the data.
Any advice, recommendation?
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