Search results for query: ap

Only a handful but I sorted it out the big stuff already but it leaves a mesh of different materials. Manual work is not profitable so I need to figure out a way to separate it or dissolve only the valuable PMs. I think I figured out a way by using Sodium Thiosulphate and Copper 2 Oxide...

I also add some H2O2. My last batch of AP I started in around April I think put too much H2O2 in. Its not a loss of gold but you have to do a lot of filtering because some gold will drop out as its brown powder dissolved form as the copper builds up. I am surprised how long this stuff lasts...

...I had in mind. Barrel plating This barrel has small holes allowing the solution to flow through it and around the material. This machine itself, with a lid to cover it is another idea I have been thinking on for several years. Just replace the plating solution with AP, or even ferric chloride.

Maybe better to treat it with AP first and then HCl/Peroxide, HCl/Bleach, HCl/Chlorine to dissolve the Gold foils after. This should leave the plastic intact.

...a result in your hand, but right now you only have a partial understanding of what you're doing. First, we never talk about a high concentration AP. AP, as it was originally described, is a leach intended to dissolve the copper underneath the gold on gold fingers. It's actually a copper...

...base metals and won't allow the metals to be fully removed. Most masks also run to the edge of the boards and will hold a large amount of material under the mask and cause drastic losses as well. By the time these problems are corrected, using AP processing would end up being quicker and cleaner.

Silver will not dissolve much if Chlorides are present.

I know I am late to this toppic now, but my additional question regarding AP fumes and their control would be - did anyone tried to use 18-20 % HCl for the AP instead of regular tech grade 31 % ? Thing is - around 20% HCl is azeotrope with water at ambient pressure. It has bp around 120 °C and...

Well AP does not dissolve gold, and any gold in solution will cement right back out, not waiting for copper saturation or anything. So your assumption there is false. Pd is another story in AP. But we're talking Au here right? HCl plus H2O2 does dissolve gold, that's why you should leave it out...

Miniature experiment today on removing contaminant metals from saturated AP solution with electrolysis- it went well, I only ran it for a few hours and the solution was noticably cleaner after depositing 0.5g of metal from 150ml. I ran it at 2.5V and it drew only around 100mA. I started with...

Welcome to the forum. Please note that H2O2 is not needed to create AP, aka the cupric chloride leach. HCl and H202 will dissolve gold and this can be avoided by not using H2O2.

I think to start out you will be doing a bit of what we call cherry picking to pick out the better yielding and easiest to refine materials and shipping off the rest until you build up some confidence. That said this would be a good thread to read to start. There are threads on the forum in...

Ellias, I have moved your posts to this thread. The thread you posted in was made as an attempt to make informative info for new users of the AP process. Please read the first post in a thread before you post new questions. Ideally we want the members to read the whole thread before posting new...

I have been thinking about processing my filters from AP, I'm not sure incineration is really necessary for me since I think there won't be such a wide range of contaminants as mixed waste filters including from AR, and also I don't have as many filters as Sreetips had to deal with. Would I be...

Is this scale (large drums of AP) where an exhaust would be beneficial? Also would a plastic drum with removable top that seals tightly be OK with a pipe running up high enough to dissipate any corrosive fume? I guess this depends on where you live and how close the houses are.

You could just run the AP until the surplus Copper precipitates out as Copper (I) Chloride. It will become a whitish paste insoluble in water. Filter it out and add some more HCl and water to it and go on. The Iron Chloride will eventually foul it though.

I'm trying to make sense of this, but i don't understand what you're saying here. AP does not need H2O2 by the way.

When cementing AP, I've had some pretty hard copper layers on it. You can tap it off to expose more iron until nothing cements out anymore.

Does temperature affect the AP process? I'm pretty sure it's yes, but I'm asking since it's in the minus Celsius where I live. I guess it's no time to start AP on fingers?

Im quite surprised you dropped with material ready to be processed, im sorts of curious how you got it from the pcbs. Simplest method would be getting rid of base metals either with nitric or hcl. Hcl along a air bubbler would be cheapest with the so called AP method.

what a beautiful vintage board. Did you open the adjustable wire resistors? three on the right. there should be palladium sliders that move along the rheochord...

I’ve been down this road before. If I were you, I'd pour off the AP solution and start fresh with a weaker H2O2/HCl mix. It should help dissolve most of the base metals like copper and iron without hitting your gold too much. Tin can be a pain, but the diluted HCl should help clear out a lot of...

I may be over (?) thinking it. One thing we never seem to see is an answer such as “put a pound of pins in a gallon of AP and give it 10 days”. CuCl2 works best with an excess of chemicals and plenty of time to allow it to do the job. The one thing I learned early on is that doing anything other...

...on plating thickness. How did you treat them prior to cupelling? Copper seem to make cupelling harder so I wonder why you chose cupelling? Best approach would be Cupric Chloride etching aka the AP process. This will give you clean Gold foils which can be refined or melted as is. Edited to...

...Hokes book at all? Anyway it is common practice to use the tested and proven ways until you master them before you start experimenting with unknown procedures. AP (Copper Chloride etch) is recommended for thin layers of Copper, but use air bubbling in stead of Peroxide. HCl are fine for steel.

I think it might work for those few who can or will run low grade pins by multiple pound lots. The only downside is that large bunch’s of pins in AP can very often cement the copper out of the solution. A pound or two in a five gallon bucket, even if it held 3-4 gallons is a problem. The...

...company called Harbor Freight (which ironically sells mostly Chinese manufactured goods) makes this small cement mixer. I have seen refiners remove the top half and mount a 5 gallon bucket in there. They use it for small CN strips but it should work equally well for AP to keep the load...

Yes I did...

...I missed to quote the question so I corrected that now. To complete the picture: It only makes sense to add peroxide once, at the beginning of the AP process as "kickstarter". If done later it will be of no use. The bubbler takes care of introducing oxygen and added peroxide will mostly lead...

My experience came from larger lots and commercial refining so personally I would need other input to recommend AP threads, although I think they will be helpful.