Scott2357
Well-known member
I read HCL alone would not dissolve copper without an oxidizer like H2O2. This link I picked up from here also shows this although there's no mention of temperature or concentration being a factor. http://www.teachersdomain.org/asset/lsps07_int_metalshcl/
I was trying an experiment to selectively dissolve solder from a memory stick PCB. It was old so I would assume it was tin/lead and not the Rohs solder used today. This was an unpopulated blank board but was pre tinned with solder. It was cold out so I warmed the solution to about 90-100' F with a crock pot to speed things up. After a while the solder dissolved away making the solution a light green color and began to show the copper pads. About 50% of the pads still had solder so I let it sit a bit longer but when I came back most of the copper had dissolved too and it had become a darker green? I decided that even though this was not supposed to happen that possibly the concentration was too high and so diluted with water to about 15% HCL. This stopped the process on the remaining copper but also precipitated the copper from solution onto all the remaining metal surfaces making the solution clear again. The precipitant had an affinity to the metal surfaces but didn't actually stick to it. It continued to slowly dissolve the remaining solder but not any more copper.
What did I miss, can someone explain? :?:
I was trying an experiment to selectively dissolve solder from a memory stick PCB. It was old so I would assume it was tin/lead and not the Rohs solder used today. This was an unpopulated blank board but was pre tinned with solder. It was cold out so I warmed the solution to about 90-100' F with a crock pot to speed things up. After a while the solder dissolved away making the solution a light green color and began to show the copper pads. About 50% of the pads still had solder so I let it sit a bit longer but when I came back most of the copper had dissolved too and it had become a darker green? I decided that even though this was not supposed to happen that possibly the concentration was too high and so diluted with water to about 15% HCL. This stopped the process on the remaining copper but also precipitated the copper from solution onto all the remaining metal surfaces making the solution clear again. The precipitant had an affinity to the metal surfaces but didn't actually stick to it. It continued to slowly dissolve the remaining solder but not any more copper.
What did I miss, can someone explain? :?: