Geld Konig
Well-known member
Hi,
I have about 700 cell phone boards to process. So, I ask what the best way to process them.
In the boards there is only IC and capacitors. Others parts I pick up out of the board.
Processes:
I) Use HNO3 to atack the ICs and capacitors off the boards. Certainly some Au plated will be out off the boards. And some Ag are in the solution in the form of AgNO3 with some Pb(NO)2.
Before this, use AR to remove all rest of gold plated of the board.
II) Use a hot form to remove the ICs and capacitors. Before this use AR or AP process.
III) Use AP process to remove all parts (ICs, Capacitors, Au plated)
IV) Use HCl to remove the solder ( Pb & Sn ) and so, it more easy to take the ICs and capacitors.
V) Use another physical method to remove ICs and capacitors.
All parts of Fe, plastics and contacts( like slots) are removed off boards.
I know the best way are concentrate the Au in solid form and before this to process it.
The ICs must be process in a batch, separately and finely broken.
What do you think about?
Thanks to any suggestion.
http://goldrefiningforum.com/phpBB3/posting.php?mode=post&f=37#
I have about 700 cell phone boards to process. So, I ask what the best way to process them.
In the boards there is only IC and capacitors. Others parts I pick up out of the board.
Processes:
I) Use HNO3 to atack the ICs and capacitors off the boards. Certainly some Au plated will be out off the boards. And some Ag are in the solution in the form of AgNO3 with some Pb(NO)2.
Before this, use AR to remove all rest of gold plated of the board.
II) Use a hot form to remove the ICs and capacitors. Before this use AR or AP process.
III) Use AP process to remove all parts (ICs, Capacitors, Au plated)
IV) Use HCl to remove the solder ( Pb & Sn ) and so, it more easy to take the ICs and capacitors.
V) Use another physical method to remove ICs and capacitors.
All parts of Fe, plastics and contacts( like slots) are removed off boards.
I know the best way are concentrate the Au in solid form and before this to process it.
The ICs must be process in a batch, separately and finely broken.
What do you think about?
Thanks to any suggestion.
http://goldrefiningforum.com/phpBB3/posting.php?mode=post&f=37#