archeonist
Well-known member
- Joined
- Jun 27, 2012
- Messages
- 286
kurtak said:archeonist said:The excess copper will use up the nitric and the rest of the copper will cement out the gold and all other metals above copper in the reactivity series.
Per the underlined --- you got that wrong --- copper cements "only" the metals BELOW copper
That's why we use copper
Zinc will work too.
In this case - NO - you do NOT want to use zinc --- he started with CPUs &/or ceramic ICs - zinc is "way high" in the reactive series & will therefore cement "everything" BELOW zinc which means you will end up with a mess of just about everything dissolved in the "first place"
zinc is used (only) when your solution is relatively clean to start with - such as cementing PGMs "after" gold has been dropped with SMB (or other chem precipitant)
Edit to add; - in this case - cementing with zinc is BAD advice :!:
Kurt
Well I know very well what I am talking about Kurt but I think you guys in the US write the reactivity series beginning with the most reactive metal or least noble. Here we begin with the least reactive metal or most noble, for instance:
Au Most noble
Ag
Cu
Fe
Zn
Na Least noble
That is why I say above, copper cements Ag and Au. I shall stick with the US way.
Zinc will cement both Au and Ag, but of course all other metals like Fe and Cu so in the case of having just Au in solution Zn will work but here this is not recommend for all other metals will cement from the dirty solution, good point there.