Hi, I'm new to this forum and I'm sorry if there is already a topic covering this, but I have been unable to find it after searching, so please excuse my ignorance. So I am planning on dissolving circuit boards in nitric acid first (using a 50/50 solution of nitric and hydrogen peroxide, please speak up if this is a bad/incorrect method) to dissolve everything but gold and plastic which i can separate later. My question revolves around any problems I will be facing when trying to precipitate the silver from the used nitric acid. What other metals will precipitate out with the silver if I use copper? I already understand palladium will, but what about tin, lead, nickel, etc? Also what ever metals precipitate, will they be in large enough quantities to present a problem to the purity of the silver? If so, how may I remove any waste metals like tin, lead, nickel while only separating the solver from the palladium to melt down at a further point? Sorry if my demands are extraordinary, I'm new to this all and I'm just trying to understand everything before I do something stupid. One more thing, I am looking for nitric acid to use for this and aqua regia, and I have had awful luck finding it anywhere but online. I would prefer to buy in person as it is easier for me, so if anyone knows where i can buy some in the Metro Detroit area, please inform me, if no one is familiar of that area a generic "oh, I buy mine at the local XXXX store!" is extremely appreciated. To clear things up I will be dissolving whole circuit boards with the exception of the tiny battery cell-like things I pulled ocassionally on boards. Again I'm sorry for my poorly worded, and high demands but I am new to the entire process and need all the help I can get, all help is extremely appreciated, thanks in advance!