hatemelborai
Member
- Joined
- Mar 18, 2012
- Messages
- 21
I would like to remove all components of Motherboards using chemical ACIDS
I read that in India the dissolution of solder is done with HBF4/ 0.3 M Ti(IV) at 60 deg. C using oxygen sparge. this procedure does not affect on Cu or on any components
After dissolution of the solder, the components were simply removed and electronically tested. then we can recover the components and connectors easily.
Can any one send me more details about solder dissolution.
Thanks
I read that in India the dissolution of solder is done with HBF4/ 0.3 M Ti(IV) at 60 deg. C using oxygen sparge. this procedure does not affect on Cu or on any components
After dissolution of the solder, the components were simply removed and electronically tested. then we can recover the components and connectors easily.
Can any one send me more details about solder dissolution.
Thanks