jungle_Dave
Well-known member
Hi Everyone, This is my first real question (yea!!)
Im setting up my lab in a country that acids are hard to come by.
What otc acids I can get,
Dilute HCL 8%
Sulpheric acid ( dilute and concentrated 98% )
Dilute nitric acid 43% (insane price better to make at home but ok)
My biggest problem is with hydrochloric acid that is only available in 8% (dirty) solution.
This could work with a 1:1 8% HCL to 3% Hydrogen peroxide for an AP process to remove foils but If I want to do any refining, I need a higher concentration hcl.
This means I have to synth my own. No problem and has been covered well but I have 1 small problem. HCL will max out at 20% (azeotrope) with every process "I know" to force hydrogen chloride gas through distilled water.
AR solution or Hot HCL (crock pot method) both require "concentrated" HCl at 30-34%
Nitric and sulfuric acid can both be concentrated much higher, as I remember nitric acid can go to 60% + with distillation / temperature controlled evaporation .
The questions,,,,,
Worst case, dilute solution= slower AR reaction or lack of reactive efficiency ?
Would hot 20% HCL be enough for foil separation or base metal stripping run on Au plated/filled material?
Can I dry HCL further then 20% or is my math off, in other words is 20% really 20% :shock: ?
Im setting up my lab in a country that acids are hard to come by.
What otc acids I can get,
Dilute HCL 8%
Sulpheric acid ( dilute and concentrated 98% )
Dilute nitric acid 43% (insane price better to make at home but ok)
My biggest problem is with hydrochloric acid that is only available in 8% (dirty) solution.
This could work with a 1:1 8% HCL to 3% Hydrogen peroxide for an AP process to remove foils but If I want to do any refining, I need a higher concentration hcl.
This means I have to synth my own. No problem and has been covered well but I have 1 small problem. HCL will max out at 20% (azeotrope) with every process "I know" to force hydrogen chloride gas through distilled water.
AR solution or Hot HCL (crock pot method) both require "concentrated" HCl at 30-34%
Nitric and sulfuric acid can both be concentrated much higher, as I remember nitric acid can go to 60% + with distillation / temperature controlled evaporation .
The questions,,,,,
Worst case, dilute solution= slower AR reaction or lack of reactive efficiency ?
Would hot 20% HCL be enough for foil separation or base metal stripping run on Au plated/filled material?
Can I dry HCL further then 20% or is my math off, in other words is 20% really 20% :shock: ?