PhillipJ,
Somewhere, I have read of glycerin being used as a grain refiner for certain plating baths. However, I certainly wouldn't add any of it to your nickel or copper baths unless the original formula called for it, which is very doubtful. Plating formulas are pretty much carved in stone and it's best not to tinker with them. Plating success depends on following the original formula to a T and keeping the ingredients well within the suggested ranges. To do this right, you really need to be set up to analyze the bath ingredients.
eagle2,
I'm GSP
Welcome to the forum. I shouldn't rub it in to a Kansan, but I sure liked the outcome of the MU/KU football game Saturday night. It got pretty scary at the end, though. And now, Mizzou is #1 in the polls! I thought I'd never see that in my lifetime. Go Tigers.
I covered my version of the sulfuric process in this thread:
http://goldrefiningforum.com/phpBB3/viewtopic.php?t=226
I think you're making a mistake by using weak sulfuric. As I understand it, you're using 4 Molar, which is only 20-25% sulfuric. This is why you're having problems with the copper dissolving and plating out. The stronger the sulfuric, the less copper (or, anything else) will dissolve.
I always used concentrated (~96%, by weight) technical grade sulfuric with about 5% to 10% water, by volume, added (add the acid to the water!!). You need a little water to perk up the speed. A 10% water addition, by volume, is equivalent to about a 5% addition, by weight, since the sulfuric is almost twice as heavy as water. Conc. sulfuric can be used without the water but, a little water will speed it up. If you're in a humid climate, only use 5% water as the sulfuric will absorb water from the air.
I daily stripped the gold and gold braze from reject, sealed, side-braze CPU packages in this system, at the rate of about 50,000 to 100,000 of them per week. This was a commercial venture. I mounted them on bare brass or copper racks, using piano wire spring contacts to hold the parts. There was little or no attack on any part of the rack, tank, or other portions of the packages, when using the strong sulfuric (it was slightly modified - my invention - in order to strip the brazes). I then re-plated the packages and returned them to the customer for re-use - Intel, AMD, and AMI were my biggest customers. We basically recycled their reject parts, for re-use, and charged them half the cost of a new package. Since most of the gold value was in the brazes used on the chip and the sealing lid, we removed much more gold than we put back on. The extra gold recovered essentially paid for the process.
I used a 50 gallon welded mild steel tank and made the tank the cathode. After using it daily, at room temp, for about 2 years, there was hardly any visible attack on the tank, except a little at the solution surface, where the acid, the steel, and the oxygen in the air all met. Don't use stainless - it will be slowly eroded, due to the presence of the Cr and Ni. Nickel (and probably cobalt) is the bad actor in this system. If too much is dissolved, it will stop the action. I have thought about adding a little potassium dichromate to the sulfuric to inhibit the attack on the nickel, but I've never actually tried it.
Your use of a glass fish tank is scary. I sure wouldn't want 4 gallons of sulfuric in my lap. If you go to the strong sulfuric that I suggest, you must go to a steel tank because it will likely attack the cement that holds the glass tank together. Search around a scrap yard and you will find some sort of mild steel container that is just the right size and shape for what you need - cheap. I would try to find a container that is at least 1/8" thick.
When using the stronger sulfuric, you will get far less fizzing than you will with a weaker solution. The trick is to start the rectifier at zero and slowly crank it up. At first, the amps are high and the volts are low. After about a minute, the amps will drop, somewhat, and the voltage will increase. As you slowly crank up the voltage, the amps will first increase and then will decrease. At some point, when the gold is completely stripped, the volts will be at about 9 (or, higher, if desired) and the amps will be zero. At this point, all of the gold is stripped. This won't work with a more dilute sulfuric because it will continue to attack the base metals and will therefore continue to draw current.
With the stronger sulfuric, nothing deposits on the cathode (the mild steel tank). The gold forms as a powder and settles to the bottom. The solution is then drained off and the gold is easily recovered and then refined in aqua regia.
I might mention, eagle2, that there's a hell of a lot of difference in concentrated sulfuric (96%+) and battery acid (about 40%) in this system. The battery acid will dissolve almost everything. Conc. sulfuric, with a little water, will only essentially dissolve and precipitate the gold. There will only be very minor amounts of base metals in the gold sludge.
When using the conc. sulfuric with only 5-10% water, by volume, regular gold plating will completely be removed in a minute or two. Sure beats 30-40 hours. With my modification to the solution, the gold brazes took about 15-20 minutes.
I've only dented the surface of this subject. I have maybe 20 years experience of working daily with this solution on a grand scale. I'm game, if you want to go deeper into this.
TERMS: My definitions. There are variations but these give the general idea.
Electrowinning. The electrodeposition of metals that have already been put into solution before the solution is put into the electrowinning tank. Uses an inert anode. Pure metal deposits on cathode. Impurities remain in the solution.
Electrorefining. Electrolytically dissolves an impure anode and simultaneously deposits pure metal at the cathode. Those impurities that dissolve remain in the solution. Those that don't dissolve are usually collected in an anode bag.
Electrostripping. Selectively removing a metallic coating, electrolytically. The dissolved metal either plates onto the cathode or immediately precipitates out, as in the gold/sulfuric system, above.