H2O2 pre-treatment

[Hascrack]

I am currently doing RAM chip ashing and was wondering if there might be any benefit or problem with pre-soaking the strained ash in 15-20% H2O2? I have plenty of peroxide and figured that in theory the copper could be oxidized and everything dried then tossed into some HCL. In theory wouldn't this allow the HCL to quickly attack the copper without having to worry about forming CL2 and accidentally dissolving the gold as well?

I know it probably isn't the most efficient use of the peroxide but I want to make sure it won't mess things up. I searched around and couldn't find any posts where someone has tried.

 

[Yggdrasil]

I am currently doing RAM chip ashing and was wondering if there might be any benefit or problem with pre-soaking the strained ash in 15-20% H2O2? I have plenty of peroxide and figured that in theory the copper could be oxidized and everything dried then tossed into some HCL. In theory wouldn't this allow the HCL to quickly attack the copper without having to worry about forming CL2 and accidentally dissolving the gold as well?

I know it probably isn't the most efficient use of the peroxide but I want to make sure it won't mess things up. I searched around and couldn't find any posts where someone has tried.

I can't say for sure, but Peroxide by itself will not do much more than dissolve some aluminum and other similar metals (Strong Peroxide).
The Copper is easily attacked by Nitric or a Copper Chloride etch (AP), not so quickly though.
I think the consensus here on the forum is to gravity separate the bonding wires, this will create much less waste.