Ayham Hafez
Well-known member
I dismantle motherboard components using heat gun, so always some tin stuck on ic chips, is it
Incineration then grinding then incinerate the powder again then use dilute nitric acid after that use AR, this is my process.Incineration or pyrolysis?
Ideally you should pyrolize first, as this reduces the released fumes and smoke.Incineration then grinding then incinerate the powder again then use dilute nitric acid after that use AR, this is my process.
So its not important to get rid of tin first before start incinerationIdeally you should pyrolize first, as this reduces the released fumes and smoke.
At least you should make sure the incinerated powders has no more carbon left.
Then it should be washed and concentrated by gravity before leaching.
This will reduce the risks of losses during and after leaching.
Of course, but I was more focused on getting rid of the Carbon.So its not important to fit rid of tin first before start incineration
I read an article by Kurtak, but he didn't mention tin, I read from internet that tin exist inside some chips, so why it never make metastannic when removing the base metals using nitric acid?Of course, but I was more focused on getting rid of the Carbon.
What ever Carbon is left will/may lock up Gold when dissolved.
Have you read all the threads from Patnor, Tzoaks, Kurtak and more on this subject?
Most that process chips will not use Acids until the absolute last steps, it then is just a small amounts of bond wires left.I read an article by Kurtak, but he didn't mention tin, I read from internet that tin exist inside some chips, so why it never make metastannic when removing the base metals using nitric acid?
I'm reading, I read your post in one article talking about metastannic by nitric when added to BGA chips, but you didn't mention the proper process to avoid that, I also have BGA chips and willing to incinerate them like the ic chips process.Most that process chips will not use Acids until the absolute last steps, it then is just a small amounts of bond wires left.
These do not have Tin on them so it is not an issue.
I recommend reading the threads from all of these.
No answer to your question, must be too complicated.I dismantle motherboard components using heat gun, so always some tin stuck on ic chips, is it
To be in safe side, I soaked them all in HClNo answer to your question, must be too complicated.
Not my posts, the threads from Kurtak, Patnor, Tzoaks and others dealing with exactly what you plan to do.I'm reading, I read your post in one article talking about metastannic by nitric when added to BGA chips, but you didn't mention the proper process to avoid that, I also have BGA chips and willing to incinerate them like the ic chips process.
I'm looking for it now...Of course, but I was more focused on getting rid of the Carbon.
What ever Carbon is left will/may lock up Gold when dissolved.
Have you read all the threads from Patnor, Tzoaks, Kurtak and more on this subject?
I think there are 2 separate yet important steps being discussed here. The Hydrochloric Acid will help minimize the tin you will have to deal with if it remains to dissolve in aqua regia.So its not important to get rid of tin first before start incineration
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