bswartzwelder
Well-known member
- Joined
- Oct 24, 2011
- Messages
- 660
I plan on processing some computer chips in the future, and want to do it with the least amount of trouble (mistakes). Time is of no consideration at this point, and I have some ideas on how to proceed, just want to see if my ideas agree with you guys. There are many different types of chips, so I assume there will be many different ways of processing.
1. First type of chips are the CPU chips with beautiful gold plated pins. The pins will not come off even after heating with a propane torch. I believe the pins are somehow embedded into the green fiberglass which the CPU is on. There are a few surface mount components which have been soldered in place on the fiberglass. I know the lead and tin may present problems, but they are in extremely small quantities. My idea: Soak in H2SO4 to get rid of solder, then pyrolyze and incinerate. This will release the pins. Place pins in AP to get rid of base metals. Process the ashes from the pyrolization/incineration process in AR. I am not good at panning, so that is not really an option for removing the gold from the ashes.
2. Second type of chip(s) also have beautiful gold plated pins. The pins will come off after heating, but with the number I have, this might take weeks, or even months. Also, if you heat them up and rap them onto a hard surface, any solder which is molten, could flow onto another pin nearby. This could possibly spread the solder over the whole batch of pins, making it into a bigger problem. My idea: Soak in H2SO4 to get rid of the solder and release the pins, then place the pins into AP to dissolve base metals. Process the pin-less chips with those from above.
3. Third type of chip looks like a black CPU chip, except it was soldered into place. I will include ALL surface mount chips in this process. When the circuit board on which the chip(s) were mounted was heated, the chip(s) popped right off. However, the underside of the chip is covered with little dots of solder. In some areas, there are even blobs of solder where the solder from numerous connections have amassed. There are some non-CPU chips which were soldered along their edges, but I don't see any pins. My idea: Soak in H2SO4 to get rid of the solder, then add to the chips above and process as above.
4. Fourth type of chips, are black chips with a row of pins (connectors) on 2 or all 4 sides of the chips. The pins/connectors made contact with a socket and the chips had to be pried loose. I do not see any gold plating anywhere on the connecting pins. Likewise, I do not see any solder anywhere on the chips. Too many chips to break off the connector pins, plus that leaves the pieces that are sandwiched between the top and bottom of the chip halves. My idea: Place in AP to dissolve base metals (connectors/pins). May take a long time to work up between the chip halves, but they can sit all winter long if need be. Then, process with chips in (1.) above. An alternative method would be to pyrolyze and incinerate first. Then sift the ashes very carefully through my classifying screens. I have screens ranging from 1/2 inch all the way down to 1/100 inch, so I know I could get the metal pins/connectors out somewhere along the line. Using AP first may take a long time and use up a fair amount of chemicals. Pyrolyzing/incinerating first will save on chemicals, and there should be no solder related issues. How much will I lose in values where the super thin gold wires are connected to the legs of the pins? Is it worth running in AP first?
What if I just throw everything into one bucket and start processing a handful at a time? Someone once mentioned putting chips into a blender or a meat grinder. If I just pyrolyze everything together, the pins which contain gold could attach to other pins which may or may not contain gold. Also, any gold interconnecting wire(s) inside the chips could get caught up in any solder not removed first. Am I making this too hard, or am I over simplifying it? There are so many different ways to approach this, and my first priority is to do it correctly and safely. My second priority is to keep loses to a minimum. I believe Samuel-a started a thread on how he did the green chips, I will start my reading there. But, I have more than just the green chips. I've made mistakes (by the busload) in the past. I just want to minimize those mistakes in the future. I also know that where chips are concerned, pyrolysis and incineration are the preferred way to go.
1. First type of chips are the CPU chips with beautiful gold plated pins. The pins will not come off even after heating with a propane torch. I believe the pins are somehow embedded into the green fiberglass which the CPU is on. There are a few surface mount components which have been soldered in place on the fiberglass. I know the lead and tin may present problems, but they are in extremely small quantities. My idea: Soak in H2SO4 to get rid of solder, then pyrolyze and incinerate. This will release the pins. Place pins in AP to get rid of base metals. Process the ashes from the pyrolization/incineration process in AR. I am not good at panning, so that is not really an option for removing the gold from the ashes.
2. Second type of chip(s) also have beautiful gold plated pins. The pins will come off after heating, but with the number I have, this might take weeks, or even months. Also, if you heat them up and rap them onto a hard surface, any solder which is molten, could flow onto another pin nearby. This could possibly spread the solder over the whole batch of pins, making it into a bigger problem. My idea: Soak in H2SO4 to get rid of the solder and release the pins, then place the pins into AP to dissolve base metals. Process the pin-less chips with those from above.
3. Third type of chip looks like a black CPU chip, except it was soldered into place. I will include ALL surface mount chips in this process. When the circuit board on which the chip(s) were mounted was heated, the chip(s) popped right off. However, the underside of the chip is covered with little dots of solder. In some areas, there are even blobs of solder where the solder from numerous connections have amassed. There are some non-CPU chips which were soldered along their edges, but I don't see any pins. My idea: Soak in H2SO4 to get rid of the solder, then add to the chips above and process as above.
4. Fourth type of chips, are black chips with a row of pins (connectors) on 2 or all 4 sides of the chips. The pins/connectors made contact with a socket and the chips had to be pried loose. I do not see any gold plating anywhere on the connecting pins. Likewise, I do not see any solder anywhere on the chips. Too many chips to break off the connector pins, plus that leaves the pieces that are sandwiched between the top and bottom of the chip halves. My idea: Place in AP to dissolve base metals (connectors/pins). May take a long time to work up between the chip halves, but they can sit all winter long if need be. Then, process with chips in (1.) above. An alternative method would be to pyrolyze and incinerate first. Then sift the ashes very carefully through my classifying screens. I have screens ranging from 1/2 inch all the way down to 1/100 inch, so I know I could get the metal pins/connectors out somewhere along the line. Using AP first may take a long time and use up a fair amount of chemicals. Pyrolyzing/incinerating first will save on chemicals, and there should be no solder related issues. How much will I lose in values where the super thin gold wires are connected to the legs of the pins? Is it worth running in AP first?
What if I just throw everything into one bucket and start processing a handful at a time? Someone once mentioned putting chips into a blender or a meat grinder. If I just pyrolyze everything together, the pins which contain gold could attach to other pins which may or may not contain gold. Also, any gold interconnecting wire(s) inside the chips could get caught up in any solder not removed first. Am I making this too hard, or am I over simplifying it? There are so many different ways to approach this, and my first priority is to do it correctly and safely. My second priority is to keep loses to a minimum. I believe Samuel-a started a thread on how he did the green chips, I will start my reading there. But, I have more than just the green chips. I've made mistakes (by the busload) in the past. I just want to minimize those mistakes in the future. I also know that where chips are concerned, pyrolysis and incineration are the preferred way to go.