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Non-Chemical Lapping or filling plated surfaces.

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GrailSeeker

Well-known member
Joined
Sep 12, 2010
Messages
46
Hi, apart from separation with electricity or chemicals, there is another way which at least in theory might work, as long as someone has a GP surface large enough to handle on sanding papers and some water to minimise friction. Afterwards these particles would be much easier to process with much more controlled portions of acids. What do you guys think?

Edit: Lapping in computer modding actually removes several millimeters of metal until one reaches the core Cu package. It takes up to three hours to do that. But since in our case we are refering to perhaps microns of Au layer, I would estimate that someone might need about 10 minutes to finish each cpu or similar surface.
 

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Sure. This would even work with karated jewelry. Just imagine doing 100 of those processors.
 
We have to be careful with this method - its easy to lose values in form of fine dust in case of sudden draft or sneezing. :)
 
See those monolithic capacitors between your fingers? You most definitely do not want to breath any dust from them!
 

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