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Salts are just ionized metals in solution bonded to another element or as an insoluble solid.
It's knowing how these salts can be made soluble or separated from other sals that make hydrometallurgy and refining possible and so much fun to do.

Read Hoke.

Pd and Ag dissolve in nitric.
Au and Pt dissolve in AR.
Pt stays in solution when dropping gold by SMB i think.
I would get the Au, Pd and Ag out and cement the PGM's on copper and melt them with silver to lower the melt temp of the PGM's.
Separate silver nitrate from Pd by making AgCl and filtering out the Pd solution.
PGM salts are extremely toxic. Be very carefull.

Martijn.
Awesome thanks! I’ll go freshen up in hokes’ book on cementing. I’ve only come across some type of crystalline salt as mentioned and pictured earlier in the thread. I think what worries me is that with some of the material I work with, e scrap in particular has all kinds of PM’s, so I could drop the gold but then there could be all sorts of pd, at and pt still in the mix. Then if they some how turn into salts I’d have no idea which salt it is to make it soluble again!

I’m sure that anxiousness will disappear with more experience, but for right now I’d like to avoid it! I think for now I’m going to focus on the Au and Ag, but I’ll still keep all my stockpot liquid for a future pd and pt extraction.
 
So for right now I’m leaving these beauties on the back burner, I’d appreciate anyone’s input on these types of boards!
43310-9b305707b7350dc8dfe542a96ce5064b.jpg

From what I can tell from the picture, they seem to be ENIG plated. I personally don't consider these "gold plated".... think of it as a wash coat (for lack of a better term). The gold doesn't generally come off as foils but rather as a black powder. That would make the plating very low yield. I've always had a love/hate view of these types of boards, to pretty to throw away but terrible to process....At least at a hobbyist level.


From Wikipedia:
"Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes. It consists of an electroless nickel plating, covered with a thin layer of gold, which protects the nickel from oxidation. The gold is typically applied by quick immersion in a solution containing gold salts. Some of the nickel is oxidized to Ni2+ while the gold is reduced to metallic state. A variant of this process adds a thin layer of electroless palladium over the nickel, a process known by the acronym ENEPIG.

ENIG can be applied before or after the solder mask, also known as overall or selective chemical Ni/Au, respectively. The latter type is more common and significantly cheaper as less gold is needed to cover only the solder pads."
 
Those are the kind of boards I use to keep a large barrel of AP for. Toss them in, pull out the bare boards when I need more room. Reduce the copper, melt it all to anodes and rum them in a copper cell. The clean copper is useful or sellable, and you have access to the gold from the slimes. The kind of stuff I do when I get bored and feel like doing something.
 

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