AuAgReclaiming
New member
I have the same situation, in that I have a lot of old gold plated electronic parts that have a thicker plating. This is an interesting read. My attack to this is to melt the metals into a long thin bar & then use electroplating of the Cu Sb Pb that will form clorides or sulfates, & those that don't will sluff off to a mud in the bottom. Andacopper does this to refine Cu & mud pays for the process. You can use a carbon arc to melt the "pins" & use a solar VP for DC power to plate with & it will be slow. So look at it & make adjustments as needed & do something else.Dear God. You've continued doing all of this inside?? I'm guessing, based on the age of this post, that you're either dead or have learned better.
Use HCl for Ag l plating, for the AgCl doesn't desolve in H2O & will be a mud at the bottom. You will have to add small amouts of HCl to the plating bath as platting & AgCl partisapated out.