Loaded question guys!
I was successful w/ AP & HCL+CL, but not 100% successful with AR on the first try. First time I just dumped 10 intermidiate cpus in AR Sams way, which made a huge mess. I guess I was trying to use excess poorman's AR to complete the process. I will try AR sometime later, but I think HCL+CL is easier since it worked for me. I understand that I have to leach out base metals first to make my life easier. So what I did was put 5 intel pentiums in a beaker w/ 100ml of nitric + same about of reverse osmosis water (total 200ml). Legs fell off in every 5 cpu batch after about 2.5-3 hours where I added little bit more water so I was not running things dry at near boiling temperature. 5-10% of pins I still had to removed manually. Wasn't too hard. Some fell of from me breathing. I did notice some pins floating, but most still had alot of base metal inside the tube. At this point I desided not to waste any more nitric acid (not cheap) & put those in my sulfuric cell - totally different from what I tried to do in the first place, but kind of made sense...less "mess" to deal with...rest of CPU will go into AR or HCL+CL . Had serveral amps running through for a minute on those pins which were on a copper mesh. However, I was not able to get those cpu pins to a nice tin color as I could with fiber cpu or motherboard pins or cpu lids. I did move the pins around w/ glass rod to get a better contact, but there was definitly some yellow color on the pins ( not as thick as before sulfuric cell process). Question 1: Was that brass/copper under the coating or what -(sorry no picture taken)? Did I not finish reverse plating somehow? I know I couldn't get any more amps to go through. & Question 2: goldchild mentioned that nitric or HCL should be used to removal base metals. I am using too much/wasting nitric or not using enough? If not, could put this partially spend nitric in a container & try puting more nitric on the cpus to complete the process? Let's say 100ml+100ml water. If necessary repeat again?
P.S. I'm aware that pins could also be removed in AP + it is probably cheaper? But, I'm not sure I want to remove base metals that way. Also, I think Hoke's way is HCL, then Nitric, and lastly sulfuric to remove base metals if I remember correctly. Any thoughts?
Thanks for the time explaining,
-Mike
I was successful w/ AP & HCL+CL, but not 100% successful with AR on the first try. First time I just dumped 10 intermidiate cpus in AR Sams way, which made a huge mess. I guess I was trying to use excess poorman's AR to complete the process. I will try AR sometime later, but I think HCL+CL is easier since it worked for me. I understand that I have to leach out base metals first to make my life easier. So what I did was put 5 intel pentiums in a beaker w/ 100ml of nitric + same about of reverse osmosis water (total 200ml). Legs fell off in every 5 cpu batch after about 2.5-3 hours where I added little bit more water so I was not running things dry at near boiling temperature. 5-10% of pins I still had to removed manually. Wasn't too hard. Some fell of from me breathing. I did notice some pins floating, but most still had alot of base metal inside the tube. At this point I desided not to waste any more nitric acid (not cheap) & put those in my sulfuric cell - totally different from what I tried to do in the first place, but kind of made sense...less "mess" to deal with...rest of CPU will go into AR or HCL+CL . Had serveral amps running through for a minute on those pins which were on a copper mesh. However, I was not able to get those cpu pins to a nice tin color as I could with fiber cpu or motherboard pins or cpu lids. I did move the pins around w/ glass rod to get a better contact, but there was definitly some yellow color on the pins ( not as thick as before sulfuric cell process). Question 1: Was that brass/copper under the coating or what -(sorry no picture taken)? Did I not finish reverse plating somehow? I know I couldn't get any more amps to go through. & Question 2: goldchild mentioned that nitric or HCL should be used to removal base metals. I am using too much/wasting nitric or not using enough? If not, could put this partially spend nitric in a container & try puting more nitric on the cpus to complete the process? Let's say 100ml+100ml water. If necessary repeat again?
P.S. I'm aware that pins could also be removed in AP + it is probably cheaper? But, I'm not sure I want to remove base metals that way. Also, I think Hoke's way is HCL, then Nitric, and lastly sulfuric to remove base metals if I remember correctly. Any thoughts?
Thanks for the time explaining,
-Mike