bswartzwelder
Well-known member
- Joined
- Oct 24, 2011
- Messages
- 660
I have read with great interest what the forum has had to offer. It is quite obvious there are many experts here and I wish to publicly thank them at this time for all the help they have given me and others over time. For some of the chemical processes, I have noted the following. Please correct me if I am wrong. Constructive criticism is a very useful learning tool provided you learn from your mistakes and the mistakes of others.
Read the Safety precautions associated with the various chemicals you will be using. Use the necessary gloves, mask, apron, and any other safety gear to protect yourself against accidents. Have a backup plan if an accident does happen. Most of these reactions involve giving off gasses which can be anything from a major nuisance to deadly. Work under a fume hood or outdoors away from the fumes. Keep pets and Children away. Have the Material Safety Data Sheets (MSDS) of any chemicals being used close at hand. Use good chemical procedures like recapping acids and other solutions immediately after using them. This may prevent a spill or mitigate the problems associated with a chemical spill. It also helps keep you from putting the wrong lid on the wrong chemical when using more than one liquid.
AR - Aqua Regia (old process) For thousands of years, Aqua Regia has been a process for purifying gold. You add 3 measures of Hydrochloric acid with 1 measure of Nitric acid. Add in your gold bearing precious metals (PMs), and let everything dissolve. Get rid of the excess Nitric acid by boiling (not a great idea since you will lose some PMs), evaporation, or killing it with something like urea. Filter out anything which doesn't dissolve. Precipitate the gold with Sodium Metabisulfite. Test the remaining solution with Stannous Chloride to make sure all the gold has dropped (precipitated). If Stannous test is positive, add more SMB to finish dropping the gold. Other PMs other than gold may be present.
Pros: Old, reliable method used for centuries. Can get gold approaching 99.95% pure.
Cons: It is very wasteful of Nitric acid which can be expensive. You are working with acids.
AR - Aqua Regia (new process) Start out with enough Hydrochloric acid to dissolve all the PM's you will be working with. Add the PM bearing materials. Slowly, in small steps, add Nitric acid utill everything dissolves. Drop gold with SMB. Test remaining solution with Stannous Chloride.
Pros: Can get gold approaching 99.95% pure. Does not waste Nitric acid. Therefore more cost effective.
Cons: May not be as fast as old AR method. Still working with acids.
AP - Acid/Peroxide. Great method for dissolving base metals leaving gold behind. Excellent for printed circuit boards (PCBs). Don't confuse the use of PCBs in this post for anything else like Poly Chlorinated Bi-Phenyls. Start out with enough Hydrochloric acid to dissolve the base metals. Add the printed circuit boards. Next add Hydrogen Peroxide. It may help to agitate the solution mechanically or with air bubbles. After a while, the base metals dissolve, leaving gold surface mounted components and sometimes solder mask behind. You may need to add more Hydrogen Peroxide and/or acid as the reaction slows down. Check solution for gold/other PMs with Stannous Chloride. Filter, rinse with Hydrochloric Acid and then water. Repeat as required to get the gold clean.
Pros: Does a good job of lifting gold plating from circuit boards. Materials needed are readily and cheaply accessible.
Cons: Can be a very slow process. Some gold may be dissolved in the process. Gold left in the process will still have to be refined. Does not use Nitric Acid.
A/Cl - Acid/Chlorox - Start out with enough Hydrochloric Acid to dissolve all the metals you will be processing. Add your metals. Next add Chlorox. The metals will dissolve in the solution. You may need to add more Chlorox and/or acid if the solution slows down and/or stops working. Drop the gold with SMB. Test the solution with Stannous to make sure all the gold has dropped. Filter gold and wash in Hydrochloric Acid and then rinse with plain water. Repeat as required to get the gold clean and bright.
Pros: Works very well at dissolving gold. I am not certain of the purity of the final gold product, but suspect it will be quite high since this method looks a lot like the AR method without the use of Nitric. All materials needed are relatively inexpensive and readily available.
Cons: Does not require Nitric acid. May be slower than AR method.
Sodium Hydroxide - (NaOH) Used to remove solder mask from printed circuit boards. Add enough Sodium Hydroxide in cold water to make a 20% solution. Slowly heat until all NaOh has dissolved. Add your circuit boards to the solution. Continue raising the heat slowly until it is almost at the boiling point. (Best not to boil it because you don't want this stuff splattering all around.) Keep at this temperature for five minutes. Remove the PCBs and place under slowly running water. Some of the solder mask should wash off by itself. You may use a small brush to see if more of the solder will clean off. If it doesn't, dry the boards with a paper towel and replace in the hot NaOH solution. Check frequently.
READ HOKE! I know this is probably a bit of an oversimplication since I have not gone into any detail of whether it should be used for karat gold, gold filled or any other gold bearing material. It was not meant to be an in depth description of the processes. It was meant only as my own personal observation from reading the way other members of the Forum have been doing things. Above all, READ HOKE! This cannot be overstressed.
Read the Safety precautions associated with the various chemicals you will be using. Use the necessary gloves, mask, apron, and any other safety gear to protect yourself against accidents. Have a backup plan if an accident does happen. Most of these reactions involve giving off gasses which can be anything from a major nuisance to deadly. Work under a fume hood or outdoors away from the fumes. Keep pets and Children away. Have the Material Safety Data Sheets (MSDS) of any chemicals being used close at hand. Use good chemical procedures like recapping acids and other solutions immediately after using them. This may prevent a spill or mitigate the problems associated with a chemical spill. It also helps keep you from putting the wrong lid on the wrong chemical when using more than one liquid.
AR - Aqua Regia (old process) For thousands of years, Aqua Regia has been a process for purifying gold. You add 3 measures of Hydrochloric acid with 1 measure of Nitric acid. Add in your gold bearing precious metals (PMs), and let everything dissolve. Get rid of the excess Nitric acid by boiling (not a great idea since you will lose some PMs), evaporation, or killing it with something like urea. Filter out anything which doesn't dissolve. Precipitate the gold with Sodium Metabisulfite. Test the remaining solution with Stannous Chloride to make sure all the gold has dropped (precipitated). If Stannous test is positive, add more SMB to finish dropping the gold. Other PMs other than gold may be present.
Pros: Old, reliable method used for centuries. Can get gold approaching 99.95% pure.
Cons: It is very wasteful of Nitric acid which can be expensive. You are working with acids.
AR - Aqua Regia (new process) Start out with enough Hydrochloric acid to dissolve all the PM's you will be working with. Add the PM bearing materials. Slowly, in small steps, add Nitric acid utill everything dissolves. Drop gold with SMB. Test remaining solution with Stannous Chloride.
Pros: Can get gold approaching 99.95% pure. Does not waste Nitric acid. Therefore more cost effective.
Cons: May not be as fast as old AR method. Still working with acids.
AP - Acid/Peroxide. Great method for dissolving base metals leaving gold behind. Excellent for printed circuit boards (PCBs). Don't confuse the use of PCBs in this post for anything else like Poly Chlorinated Bi-Phenyls. Start out with enough Hydrochloric acid to dissolve the base metals. Add the printed circuit boards. Next add Hydrogen Peroxide. It may help to agitate the solution mechanically or with air bubbles. After a while, the base metals dissolve, leaving gold surface mounted components and sometimes solder mask behind. You may need to add more Hydrogen Peroxide and/or acid as the reaction slows down. Check solution for gold/other PMs with Stannous Chloride. Filter, rinse with Hydrochloric Acid and then water. Repeat as required to get the gold clean.
Pros: Does a good job of lifting gold plating from circuit boards. Materials needed are readily and cheaply accessible.
Cons: Can be a very slow process. Some gold may be dissolved in the process. Gold left in the process will still have to be refined. Does not use Nitric Acid.
A/Cl - Acid/Chlorox - Start out with enough Hydrochloric Acid to dissolve all the metals you will be processing. Add your metals. Next add Chlorox. The metals will dissolve in the solution. You may need to add more Chlorox and/or acid if the solution slows down and/or stops working. Drop the gold with SMB. Test the solution with Stannous to make sure all the gold has dropped. Filter gold and wash in Hydrochloric Acid and then rinse with plain water. Repeat as required to get the gold clean and bright.
Pros: Works very well at dissolving gold. I am not certain of the purity of the final gold product, but suspect it will be quite high since this method looks a lot like the AR method without the use of Nitric. All materials needed are relatively inexpensive and readily available.
Cons: Does not require Nitric acid. May be slower than AR method.
Sodium Hydroxide - (NaOH) Used to remove solder mask from printed circuit boards. Add enough Sodium Hydroxide in cold water to make a 20% solution. Slowly heat until all NaOh has dissolved. Add your circuit boards to the solution. Continue raising the heat slowly until it is almost at the boiling point. (Best not to boil it because you don't want this stuff splattering all around.) Keep at this temperature for five minutes. Remove the PCBs and place under slowly running water. Some of the solder mask should wash off by itself. You may use a small brush to see if more of the solder will clean off. If it doesn't, dry the boards with a paper towel and replace in the hot NaOH solution. Check frequently.
READ HOKE! I know this is probably a bit of an oversimplication since I have not gone into any detail of whether it should be used for karat gold, gold filled or any other gold bearing material. It was not meant to be an in depth description of the processes. It was meant only as my own personal observation from reading the way other members of the Forum have been doing things. Above all, READ HOKE! This cannot be overstressed.