As to why the stannous chloride test revealed a black precipitate it is possible the result was silver chloride which darkened on light exposure:
The solder for the microPGA cpu lists the solder content as :
Which is 95% tin and 5% antimony, this does not confirm the content of the solder for the PPGA heat slug which is listed as "high temperature solder" by the same datasheet. A preliminary google search also reveals a lead free substitute high temperature solder as SAC (Sn, Ag, Cu).
Lastly a search of the Intel Package Datasheet for Palladium reveals no results whereas a search for gold and other metals reveals several results.
Steve
Intel Package Datasheet said:A silver filled epoxy adhesive is applied to the package substrate at die attach. Dice are picked
from the wafer and placed on the adhesive. The adhesive is then cured.
The solder for the microPGA cpu lists the solder content as :
Intel Package Datasheet said:After the pins are fixtured, 95% Sn 5% Sb solder is used to reflow the pins into the interposer.
Which is 95% tin and 5% antimony, this does not confirm the content of the solder for the PPGA heat slug which is listed as "high temperature solder" by the same datasheet. A preliminary google search also reveals a lead free substitute high temperature solder as SAC (Sn, Ag, Cu).
Lastly a search of the Intel Package Datasheet for Palladium reveals no results whereas a search for gold and other metals reveals several results.
Steve