You need to look inside for gold in a few of the ICs. If you remove an IC, hold it on its edge on an anvil, and tap it with light to medium force along its edge, on an anvil with a hammer, it should eventually split and expose the lead frame tips (where the wires are bonded to), the wires, the chip, and the pad where the chip is mounted to. With some, I have had good luck squeezing them slowly, edge to edge, in a vise. With that, you might not have to remove them from the board. If you get the IC package to split without crushing everything and are able to view the entire inside cavity, you will be able to see any and most all gold that is present - it will be yellow. There is no hidden gold except maybe what is directly under the chip. If you see no yellow, there is no gold.
Silver is not used on fingers. Any white metal on the fingers will be tin. With zero value tin plated fingers, I sure wouldn't expect much value inside of the ICs. Low grade or no grade, I would think. If the bonding wires are white, they are aluminum.