AnilSuthar
Member
- Joined
- Nov 17, 2017
- Messages
- 5
Hello guys,
I am new to this forum and in this field. I have separated the gold plating from all the pins. But when processing IC's and BGA chips, I tried wet ashing as it is most convenient for me at the time (I don't have anything to incinerate). I now have a mixture of sulfuric acid some metal and lot of black particles. My problem is how to separate the black particles as I can not filter the solution and I don't want to pour the solution and hope that the metals will stick in the bottom. I diluted the solution many times and drained the water but the black particles are still there. Should I use aqua regia directly(after removing base metals) or is there a problem with the black particles?
Note : All of this is on a very small scale, in a 200ml beaker. :? (It was tough due to small size for all the bubbles that came out but I managed to dissolve 100gm chips in it)
I am new to this forum and in this field. I have separated the gold plating from all the pins. But when processing IC's and BGA chips, I tried wet ashing as it is most convenient for me at the time (I don't have anything to incinerate). I now have a mixture of sulfuric acid some metal and lot of black particles. My problem is how to separate the black particles as I can not filter the solution and I don't want to pour the solution and hope that the metals will stick in the bottom. I diluted the solution many times and drained the water but the black particles are still there. Should I use aqua regia directly(after removing base metals) or is there a problem with the black particles?
Note : All of this is on a very small scale, in a 200ml beaker. :? (It was tough due to small size for all the bubbles that came out but I managed to dissolve 100gm chips in it)