oldtimmer
Well-known member
I currently have 2 batches of ICs ready to process. One is 1600 grams (about 3200 ICs) smaller ICs from memory cards. The other is around 1800 grams (about 1000 ICs) of the quad flat pack style. I have been trying to decide if poor mans Nitric Acid or AP and a bubbler is the best way to remove the base metals before I go to recover the gold.
While I dislike Nitric I believe that it would be the fastest way to go. Both batches have been run through a paper shredder as a first stage and I will process them in a coffee grinder once the copper leads are removed.
What are your thoughts? I plan on using HCl+CL as a final process to recover the gold.
Thanks, Oldtimmer
While I dislike Nitric I believe that it would be the fastest way to go. Both batches have been run through a paper shredder as a first stage and I will process them in a coffee grinder once the copper leads are removed.
What are your thoughts? I plan on using HCl+CL as a final process to recover the gold.
Thanks, Oldtimmer