hi,
i have been reading this forum for a while, but didn't succeeded to find an answer...
lets say we have a flip chip, that has gold plated circles and triangles at the corners (like in attached image). on the underside it has solder balls. i suspect that there is gold plating under these solder balls. because gold plating is covered with solder, i suspect that gold is "dissolved" in tin, thou it can not be visible after mechanical separation. could someone confirm my suspections? and if i am right, how that gold could be recovered? if i would run these chips through AP, solder and copper base will get dissolved, what will happen to "tin dissolved gold"? maybe adding excess peroxide will dissolve that gold to, and later it could be precipitated with SMB?
i have been reading this forum for a while, but didn't succeeded to find an answer...
lets say we have a flip chip, that has gold plated circles and triangles at the corners (like in attached image). on the underside it has solder balls. i suspect that there is gold plating under these solder balls. because gold plating is covered with solder, i suspect that gold is "dissolved" in tin, thou it can not be visible after mechanical separation. could someone confirm my suspections? and if i am right, how that gold could be recovered? if i would run these chips through AP, solder and copper base will get dissolved, what will happen to "tin dissolved gold"? maybe adding excess peroxide will dissolve that gold to, and later it could be precipitated with SMB?