BaalAdvocate
Member
- Joined
- May 26, 2016
- Messages
- 11
After doing some research on Youtube, I decided I finally had a use for the pile of old PCBs I had in the basement. During the course of my research of the vids, I noticed they only used the fingers for refining; I had full sticks that I wanted to process, and didn't think to depopulate the board since the etchant would dissolve the solder holding everything on the board.
Essentially, I had populated boards in the etchant solution, including the PCI slots (put in a trial MOBO) which are either (upon further research) ABS or PP plastic since they are susceptible to HCL; they dissolved into this gray-blue muck. Following advice on the PM refining Reddit, I took the muck and soaked it in an HCL bath, which helped but still contains the particulate. I set this batch aside in a second HCL bath until I can figure out how to separate it.
Since the first batch, I ran a second where I depopulated the plastics and capacitors, but left the ICCs on the sticks. As I expected, these more or less fell off into the solution with the gold foils and these tiny components which were not attacked by the HCL. During the decanting process, I noted that the same blue-gray muck was forming with the second plastic free batch. Is this the solder coming out of solution, and if so, how do I remove it from the gold foil (and fine gold particles which broke off the foils)?
I'm thinking either a soak in a greater quantity of HCL (maybe the HCL becomes saturated and loses capacity) then run it through consecutive baths in distilled water to remove the chlorine then soak in Nitric, or remove the material, dry it and incinerate. A third option that I had contemplated would be using different density media (layers of oil, water, and corn syrup or some such) then let it separate by gravity.
Any advice would be most appreciated; I don't want to lose gold yield through trial and error.
Essentially, I had populated boards in the etchant solution, including the PCI slots (put in a trial MOBO) which are either (upon further research) ABS or PP plastic since they are susceptible to HCL; they dissolved into this gray-blue muck. Following advice on the PM refining Reddit, I took the muck and soaked it in an HCL bath, which helped but still contains the particulate. I set this batch aside in a second HCL bath until I can figure out how to separate it.
Since the first batch, I ran a second where I depopulated the plastics and capacitors, but left the ICCs on the sticks. As I expected, these more or less fell off into the solution with the gold foils and these tiny components which were not attacked by the HCL. During the decanting process, I noted that the same blue-gray muck was forming with the second plastic free batch. Is this the solder coming out of solution, and if so, how do I remove it from the gold foil (and fine gold particles which broke off the foils)?
I'm thinking either a soak in a greater quantity of HCL (maybe the HCL becomes saturated and loses capacity) then run it through consecutive baths in distilled water to remove the chlorine then soak in Nitric, or remove the material, dry it and incinerate. A third option that I had contemplated would be using different density media (layers of oil, water, and corn syrup or some such) then let it separate by gravity.
Any advice would be most appreciated; I don't want to lose gold yield through trial and error.