- Joined
- Mar 19, 2021
- Messages
- 90
First...How much Sn is too much when using AR to digest e-scrap? Another words, if I am digesting 150g of top hat transistors and there is solder residue on the majority of the legs, (that is a tiny amount) am I going to run into trouble with the formation of metastannic acid? Is there a rule of thumb? Or does it have to be NO Sn whatsoever...?
If I am processing large amounts of ceramic IC's with silicon dies mounted on gold solder (is this solder?), does this solder contain Sn...?
If I am processing large amounts of IC's with gold solder but aluminum bonding wires, are there any issues with the Al reacting with AR...?
Finally, if I was to pulverize ceramic IC's to near dust, will it react with HNO3, HCL, or AR...? Is there any risk of contamination or dissolution of the ceramic components?
Thank you!
If I am processing large amounts of ceramic IC's with silicon dies mounted on gold solder (is this solder?), does this solder contain Sn...?
If I am processing large amounts of IC's with gold solder but aluminum bonding wires, are there any issues with the Al reacting with AR...?
Finally, if I was to pulverize ceramic IC's to near dust, will it react with HNO3, HCL, or AR...? Is there any risk of contamination or dissolution of the ceramic components?
Thank you!