Search results for query: ap

...Evolution of the Beginner Refiner (*lots of sarcasm here): 1) * Stumble onto this hobby 2) * Buy a thermometer to measure your Gold Fever that is approaching 3) * Start pricing-out expensive homes, cars and other luxury items, because you’re going to be rich 4) * Start thinking about building...

Well, AP and Iodine/Iodide leaches has different purposes, AP dissolves the base metals under the Gold plating while Iodine/Iodide leaches the Gold directly. And I think what they use for reclaiming the Iodine is 30% Hydrogen Peroxide. The issue is remaking the Iodide.

If it takes that long I believe you are doing something wrong. It might not be suitable for production scenarios, that is correct. But neither are wet processing. For production there is only one scenario that works properly and that is smelting. Much less waste and much higher through put

Misamis like Cagayan De Oro? I’ve been there. I’m an American. After coming here off and on I moved here last year. I’m in Luzon about an hour south of Manila.

...scalding, but i feel its deserved. While I admit my shame, I want to ensure I do what is safe. As the title states, I made a mistake with my AP solution. I have a total 200 ml of AP with a bubbler trying to break down some pins. I was wanting to add a few drops of peroxide to the mix to add a...

...This small perforated "test cylinder" will contain 5 small samples inside of it. This "test cylinder" will simply be dropped into the same AP bucket with the trimmed fingers (perhaps sink to the bottom). The reason I am keeping the test sample size small is to prevent the unknown base metals...

Yes, I stopped doing this stuff 10 years ago. Some things I'm trying and get myself confused like ascorbic and citric, however it did work a little. Some base metals almost completely removed. Yes I read a lot of Hoke over 10years ago and need a reread. Back then it was fingers, karat and filled...

...much gold to begin with. TV parts don't get plugged in and pulled out much, so they're lightly plated. We usually release gold foils with CuCl2 (AP) leach, then dissolve just the foils in AR. Don't mix AR according to a ratio. Cover the foils with HCl, then add just enough oxidizer to...

I searched few times with no results. As all common reactions, AP dissolution accellerates with raising temperature. Contrary, dissolution of oxygen in the solution decrease with temperature. Below room temperature, AP is working very slowly. Best case scenario would be hot AP with pure oxygen...

The AP will dissolve the Copper behind the Gold foils and the HCl in the AP will dissolve the Solder. But that is it the green solder mask is not touched at all. If you feel the need to remove that, you need hot NaOH solution 20% or so and it will take care of it. But be careful hot Lye is no...

Thanks for this remark. It helps me understanding, that sometimes during an AP procedure very small gold particles disappear after adding HP (in order to reoxidise Cu+ into Cu2+). So in my opinion what happens? I insist in saying the mixture of CuCl2 and diluted HCl is not able to oxidise...

Hello Let me tell you my understanding and experience of dissolution of Au during the AP procedure: CuCL2 and HCl will not dissolve Au but only Cu metal and other less noble metals like Zn,Fe,Al... by the following redoxreaction Cu2+ + Cu = 2Cu1+. This Cu1+ is existent in solution as a dark...

Is there any advantage of using AP over nitric? I believe that I've read somewhere about using AP for gold filled, but I couldn't figure out all of the pros and cons of using nitric vs AP... some clarity would be nice if anyone wants to chime in..

Look for AP process a.k.a. Copper chloride leach. remeber: trash in trash out!, clean cut fingers, no solder, no components wil give you the best result. When we dissolve gold, we don't want any epoxy, plastics, organics or carbon it there. Porous materials like PCB's soak up the AuCl...

Like many beginners it appears you have over complicated and over thought a simple process. It's okay we all did it. Any electroplated pins should not go into the bubbler HCl or "AP" solution, and everything else should, after all but gold bearing areas have been trimmed off. Then leave in the...

Came here to say this, use the “AP’ process on e-scrap. It’s the simplest, easiest and cheapest way to get nearly pure gold from plated electronic parts.

...which contain HCl acid. https://www.tesco.com/groceries/en-GB/products/258203797 Limescale remover products are usually 15-20% HCl therefore are good to be used in AP processes with 3% H2O2(which you can buy from pharmacy). It is slower but a fishtank bubbler will help you on the way. Pete.

I started with a 10g bar .999,9 pure and trying to dissolve it in AP. Using muriatic acid and 12% peroxide. Have it heated to 155. Been adding peroxide in 15 ml bumps. I’m almost 4 hours in yet the bar still looks in tact. Is AP bot as good for bullion compared to Aqua Regia. Should I raise or...

In theory it can work, copper and brass do not dissolve in very well H2SO4. The AR addition however, will. If you have pm's in solution and basemetals, the gold will cement out on the basemetals. It is never a good idea to dissolve gold in the presence of PCB'S qnd lots of base metals. 1...

Yes, inside the same AP bucket as the fingers. So, this small PVC tube (with several holes in it) will contain 5 small gold plated items. I do not know the base metals underneath the gold plating, but they are not magnetic. I have many of these small items and wish to determine to what extent...

For nonmagnetic pins, I always totally dissolve the pins. But, as time is not an issue for me, I can wait while the AP does its thing. I do it VERY slowly over WEEKS, allowing the solution to warm and cool over and over in my plastic greenhouse, until the reactants are utterly depleted, so my...

Hi, This is the same solution with the 'silver slick' on surface.. you mentioned in a reply that it protects silver? and that scraping was impractical. I understand AP will not dissolve Ag but may create an Agcl? it could however be Sn, Pb, Hg, but I have not undertaken the hot water test &...

...via desoldering tool (suction to remove more lead and tin) 2. Cleaned solder mask with lye solution 3. Cut up circuit boards and placed it all in AP solution for 2 days. 4. Mixed around 250ml hcl, 56g NaNO3 and 125 ml water to make poor man AR. (I did a stanneous test and it looked like there...

Can you walk us through how you made your AP solution? Just to start with the basics. I’ve never seen yellow or clear AP.

...buy powdered copper or waste time grinding a bar! You can reuse it indefinitely, as every electrolysis run gives you more loaded copper solutions to drop some copper out of. As does processing pins with the AP process. Plenty of sources to get fine copper crystals from your own waste stream!

Why do you think there is silver on these boards in the first place? And did the AP loosen the gold foils or dissolve them? What happened to the presumed silver parts?

...pins and connectors I placed a sample board into a beaker and covered it with HCL for a few days and as you guys predicted, the solder dissolved. My question is: If I skip this HCL step and go straight to AP, will the tin in the solder foul my perfect batch of AP? Thanking you in advance.

Just to clarify this, I did not run this as a regular work load. It was just something I tinkered with when incoming materials slowed down. (Read this as “when I got bored”) I stopped doing this some time back as other things started to keep me occupied. I haven’t run the quantities that Kurt...

Use a curved melting dish which looks like a huge contact lens made of refractory material. Glaze the dish with a little borax (I said a little borax) it doesn't take much. Do not wet the powder, place it in the center of the dish and heat the metal by circling around the outer edges of the...

Hi Dave, day 4 and this is what it looks like, I have now connected an air bubbler and its sitting on a medium heat hot plate bubbling away merrily, what say you? Should I add more Muriatic or peroxide? TIA. Steve