Ayham Hafez
Well-known member
I watched a video on YouTube done by Dusan of using sulfuric acid with hcl then add a bit nitric to dissolve only gold layer without effecting base metals, I wonder if this method is well tested by anyone here, I get tired from leaching circuit boards in hcl then AP then collect gold foils and if pins not made from copper I have to use another method than AP to strip gold foils.
And can I use same HCl-Sulfuric-Nitric solution before precipitating gold with new circuit boards to decrease the chemical cost?
Last thing, will sulfuric acid prevent tin from dissolving in the solution or I have to remove tin before?
And can I use same HCl-Sulfuric-Nitric solution before precipitating gold with new circuit boards to decrease the chemical cost?
Last thing, will sulfuric acid prevent tin from dissolving in the solution or I have to remove tin before?