Search results for query: ap

What does your stannous test say?

81.05 g of kinda ok bars 61 grams of shot ( from cemented silver from electrolyte ) 320 grams of silver crystals Some silver still on graphite cathode This concludes the silver cell experiment . Next :Cleaning up, work on those items in the AP bucket .

...so typical cut fingers wouldn’t slide through them. I would suspend this two gallon bucket inside the five gallon with around 3 to 31/2 gallons of AP. This is also when I started trying to add more air and bubbles spread over a larger area. 1/2 inch pvc formed in and H shape large enough to...

Yes - if smelting - the copper cemented from waste solutions works very well as a collector metal because the FINE copper particles mix in VERY well with the concentrates & flux when making up your "smelt load" When I was full time refining I did a lot of silver refining so I always had "a lot"...

Maybe im asking stupid questions, but im learning from every answer. Thanks guys!

Yes, but if you want a cheaper method of removing gold plate from electronics, the cupric chloride leach (often referred to as AP), is cheaper and much less dangerous. Dave

...in HCl, Nickel is harder but in hot dilute HCl or Cupric Chloride etch it dissolves. At least the Nickel plating under the Gold foils disappear in AP. Hot dilute Sulfuric is even better for Nickel. In sludge form it should be even easier, but it might be best to use HCl to remove the Tin...

What is called AP is actually a "Copper Chloride" leach. The active component is the transition between Copper I and Copper II chloride in which the dissolved Oxygen in the HCl play a crucial part. Adding Peroxide is a way of kick start it, but it is very easy to overdo it so you actually...

That will not work on pcb's. I would go for AP.

...solution, what it could be? And can I recover tin from the solution after filtering with using electrolysis method? Another question, from your experience, regardless cost, stripping gold using nitric gives more gold recovery rate than using AP or the same, materials are PCB after HCl leaching.

Filtering my AP bucket again and noticed I still have the tiny gold pins left at the bottom. I've ran these pins through 5 batches now thinking I just didn't give the base metal to dissolve and have yet to see a change. I have no clue what they are from, they're maybe 2-3mm long amd thinner than...

With the exception of cyanide waste

Here is a pdf i made to make the copper chloride circle visible. Air revives the AP.

Well since the cylinder is in the same solution and the holes are there, there is not much difference between mixing them and keeping them separate. You are makings things more complicated than they need to be.

Thanks, so electroplating is Metallic Gold not Gold Hydroxide. All the plated materials in solution have had the gold plating removed by AP. So, now i research whether the sands dislodged could be metallic gold plating, not gold hydroxide. And without acid, not using stannous until I read...

Yggdrasil... Has anyone ever posted pictures of a fully exposed board free from all soldered electronics, solder, and green mask? It would be pretty cool to get a visual on that. Also, does anyone have any specific dates when the circuitry stopped bearing gold?

...gold pins and even if you cut them in half it's still going to take several days to digest the base metals. I have some very similar pins in AP that are about 5 days in on low heat, my aquarium pump quit on me about a week ago otherwise I would have air bubbling through them. My acid was...

Nitric with tin will make tin paste and that is nightmare, most important thing is to git rid of tin from pcb. What's your opinion about using sodium hydroxide with peroxide as a begining to dissolve tin and lead then use nitric then AR?

That's great information. IDK how ewaste ben has like a million subscribers to your 100. Well, you just earned another subscriber, anyway.

Hello all, for the past days I have been reading and watching A LOT about the AP Method and it almost feels like the more I read, the more confused I get ... Already the very first step is so unclear (Mixing HCl and H2O2) I read from adding just a hint of H2O2 (1-2 caps) to 2x parts of HCl...

Ok so I was going to run/ process another batch of foils and 1/20 14-10K gold filled jewelry . Here are the steps I was going to use. Soak in AP filter HCl + Bleach ( cold ) Filter Drop w/ SMB.

HCl and air pump does not dissolve gold. This is AP, copper(ll)chloride, used to remove base metals prior to processing any gold involved. The over use of peroxide with HCl does have the limited ability dissolve gold. These are two completely different processes that do two different things...

Welcome to us :) There is no Silver in the AP. Any Chloride forms Silver Chloride immediately, Silver Chloride is not soluble in water nor acid. Even Aqua Regia will not touch Silver. What ever the AP dissolved is not Silver, but most likely Tin solder. It is obvious you need some studying and...

Another note: after filteration, i added copper to liquid to see if anything else drops. Update: nothing dropped and copper did not react...i guess my AR is fully concentrated. Ill cement my copper with iron rods now!

The reasoning is that the pins them selves are made from different materials. Magnetic ones are based on Iron or Nickel. They need different treatment than the Copper based ones which are usually treated with AP.

You do not want to boil to a syrup, you want to evaporate to a syrup. Boiling will cause losses. As the bubbles from boiling pop at the surface, they will cause tiny droplets of solution to be ejected from the container. Evaporate at a temperature below boiling. Dave

...does not require HNO3 (allthough refining can be done with AR), it is enough if on firt step you use HCl and H2O2 to loosen the foils (Also called AP or acid peroxide in general), after the foils came off You can use HCl and bleach to dissolve the foils then drop with SMB) Third...try to...

...that it can be used as in process step or actively as a part of the processing. Partly due to two things. 1. I for the most part process PCB in AP for recovery in which cementing would not be appropriate. 2. When ever I use Nitric, volumes and processing do not lend itself to have a...

AP is slow, but cheap. Nitric is faster, but usually more expensive. Dave

HCl, will not touch Copper alone and as such will not release the Gold foils. You need AP for that, HCl and air bubbling will fix this. There is no need to filter it, shake/clean off the foils with water and siphon off the fluids. Add HCl to cover it and then a bit more, add a few drops of...