Search results for query: ap

This is correct - if you rub the gray area with your finger or a wet paper towel it will expose the gold under that gray deposit on the "surface" of the gold plating It is nothing to be concerned with as it will be removed in the next step of recovery of the foils that are plated on the copper...

I appreciate the info and encouragement. I did some minor depopulating tonite. Mostly from an old router and a few pieces of pcb.

...3%, I will start with that but would like to know if a higher % Peroxide will do the job a bit quicker? His video take more than a month of AP to get all the foils off. I would like to know if there is anything that can be done about the fumes? I'm not that into releasing toxic stuff into the...

...of great importance. Personally I do not know of any pyrometallurgical processes in this realm, unless you "own" your own volcano :ROFLMAO: The AP process is one, putting your magnetic legs from ICs in a bucket outside with a splash of salt and a few drops of HCl for a few months is another...

Hello, As pictured below, I have several small blocks of copper with gold plating on the surfaces (and perhaps a nickel strike underneath the gold). I am confident that the base metal is copper, since it is non-magnetic and a density test produced ~ 8.7 g/ml. I searched the threads on this forum...

Depends on how much copper is in there dissolved. Copper chloride has very high solubility in water, 620g/L. By classic AP dissolution, you can be theoretically close to this, if no acid escape during the process. But more realistically, the real system getting close to saturation point...

No doubt HCl may be the best for eliminating tin but it is also good that we also discuss alternatives because there are several factors that affect the availability of resources for refining across the world like price, availability, regulations etc. It takes only a few drops. But maybe I'm...

Dipping gold plated in any solution that dissolves the gold will cement out any dissolved gold on the cheaper base metals underneath. Leaving you with gold powder of the dissolved part in the mix (not in solution!!) Other plated parts may not even dissolve, because the base metals are attacked...

I am not sure I understood everything, should I keep an AP batch separately to remove the solder and then use another AP batch to separate the gold foils? Should I wash the material well of traces of solder before I put them in a new batch?

I was curious about this some time ago. I was doing small ceramic SMD chips (USSR made), and I left the juice after gold drop over the copper (I have some doubts about completness of gold drop). One spiral of very thick copper wire. This was hanging in over weekend, and when I came back, quite a...

Pins are best done with the HCl-copper chloride route (AP). It's rather slow, but it does a really good job of dissolving the base metals. And it's east to reduce the copper from the waste solution as well after diluting the concentrated waste at a ratio of 1 unit of waste to 3 units of water...

Yeah, so what’s the point of your comment? We’re discussing doing it incorrectly in order to save time so the answer is is “yes, AP can risk dissolving gold if there is an excessive amount of tin remaining on the fingers prior to treatment with AP as the tin can cause colloidal gold to form”

Michel and Martijn ;)

I don't know the parts, but when I recover GF material from watches I throw the movements into AP and filter the residues a couple times a year. Then put the filter in with the rest of the filters to be procced later. There is always little bits of karat and foils. It all adds up.....

They could have been cleaner

...very comfortable putting a lot of base metals together in the same solution. Even dissolving them well in solution I think it would be a possible AP solution, it would take time to complete and it would be a new experience. Another way would be Hno3 leaching to recover and further refining...

CuCl2 (aq) will dissolve almost all base metals, Sn, Pb,Fe,Ni, Cu , steel , and Fe/Ni alloys included. Even Pd, in particular conditions, can be dissolved

Even very simple looking reactions like dissolution of things in AP are indeed very complex processes. Redox potentials can vary widely with concentrations of metal ions and their chlorocomplexes. Some of these reactions are autocatalytic, meaning higher the concentration of one product gets...

...in several of my test tube experiments. For combinations of parts, including kovar, in conc. HCl alone, for about a week nothing much would happen. Then the solution would begin to turn green. After another week, the parts all suddenly dissolved in about a day, leaving only PM plating...

I did the same thing, I tested my button and it was around 14k the ones I didn't melt I topped the solution with fresh HCI and the pins started to dissolve. Now, I'm doing another batch with some new flat pins added and they're not reacting at all but everything else is. I'm guessing it's just a...

...bonding wires will get caught up in that material. I usually grab out the big wads of it and set it aside. After my ashes are concentrated into a beaker I throw that material in and AR it with the ashes. As far as the Cu you can use Nitric to remove the base metals or AP if you're not in a...

I did add the nitric incrementaly. But maybe it didn't react right away and so I may have added too thinking it wasn't enough?

...a whole lot of other components soldered in place. There was no practical way to isolate just the gold areas. I then started the Acid Peroxide (AP) process. The AP process went exceptionally well - causing the gold foil/flakes to float in the AP solution. I then filtered as much "gunk" out...

No ordinary full strength. And yes or no depending on the board and components. If there are Gold plating/fingers you want to depopulate and remove solder first and then do AP after to dissolve the Copper and release the foils.

What do you mean with an AP cell? I have never heard that expression before.

...to vinegar, and some, but not too much salt to allow the oxygen to stay in solution, you can get somewhat exciting results on copper, and perhaps aluminium but I haven't tested that one. I would say , if you put silver in AR (which should be present around tin) you could have silver chloride...

Also Also am I reading that correctly? You process the ashes or did you mean the grounded up materials? Or are they one and the same. Either way thanks for the advice!

that makes sense, used AP is still very strong, even the second wash is impressive you could clean rusty steel apparently with it. Trying to figure out and understand the best method to process mixed IC chips. There will be a mix of values. I liked Geo's washing over and over method after...

Every time I see your picture of the plastic barrel and funnel fume hood it reminds of that AP system. I always wanted to try and see if would work the same way, I just don’t get enough escrap anymore to try it.

...Wastes" that may contain the best descriptions of how to separate precious metals from base metals and then refine them. Looking at a photograph of the metallurgist in the book, it turns out that Calm Morrison Hoke may have been an attractive lady as well. I also regularly read messages on...