Yeah, so what’s the point of your comment? We’re discussing doing it incorrectly in order to save time so the answer is is “yes, AP can risk dissolving gold if there is an excessive amount of tin remaining on the fingers prior to treatment with AP as the tin can cause colloidal gold to form”
Trimmed gold fingers that still contain solder
- Thread starter hammerdown
- Start date
Help Support Gold Refining Forum:
Only if gold is dissolved somehow.
And gold can be dissolved to some extent if you overuse the peroxide.
Copper chloride leach as is the correct name will not dissolve gold by itself.
And as such will not form colloids with tin. However there can be colloidal gold trapped in the solder already by the soldering process. When HCl dissolved that tin it can form a very dilute colloid of gold. But that process has nothing to do with the copper chloride leach as such.
