I do not dilute my acids to me the stronger the better dissolves more metal, the HCl/H2O2 and or air, on cpu's takes time to disolve solder and penetrate the gold plate, warm solutions help, usually mine bubbles in air week or two depending on outdoor temps maybe longer.
(probbably unconventional but sometimes Ill give mine a prewash in HCl/bleach OR HCL/32%H2O2 prewash to cut some gold layer off to expose base metal prior to leach).
another trick I ues to finish disolving is to heat in coffee pot cpus and pins after AP (using the AP solution this loweres evaporates alot of the water concentrating it for next time making it more acidic per volume. and finishes getting the copper out of my cpu pins that the acid and air Bubbles have a hard time with.
when strong HCl added to metals they is a vapor of hydrogen released from the acid as the Cl and copper metal combine to make a copper chloride salt (blue diluted green concentrated) disolved in solution.
the Hcl/ bleach works good for me with concentrated acids.
these are slower processes than Aqua Regia, But in my opinion,less trouble and loss with precepitation. of values especially for higher base metal content of solutions, and I usually have several different types of processes goin on at same time, with plenty to do, so time soaking actually a benefit for me Its working while Im doing something else.
I wouldnt worry about gold loss with these process just save your solutions till your sure your finished reusing them ,(maybe unconventional again but I save my acid/bleach solution to disolve gold from other process batchs adding HCl & NaOCl(clorox bleach) till I'm ready to get the gold out), also let my solutions sit for days to week / 's to allow gases to disipate or somtimes using heat to speed process.
hope I am not confusing newcomers with my way of doin these and my poor ability to explain them.