GrailSeeker
Well-known member
- Joined
- Sep 12, 2010
- Messages
- 46
Hi all,
I would like to post some thoughts just to see if they agree to a degree:
Most of the times I am using AC mask, gloves and glasses when stripping the components. I have set up a small spreadsheet, with weights, types etc. Up so far the scrap weighs about 1,5kg. I am not going to do much until I have gathered enough. Now what is enough is hard to tell, but I need to keep the gold acquiring process as a one time thing, perhaps two. It simply is more cost effective and less time consuming in the long run (confused? I know). For this, I suppose my best bet would be electrowinning.At least for the larger bulk. For small components I guess Aqua Regia is the way to go.
So here is what I have up so far:
1. a bag of various Gp connectors, boards, RAM modules etc.
2. 6 PPro Chips
3. 5 ICs in PGA package acquired from a 70's card.
4. GP pins from the same card, roughly removed.
5. Smaller particles from various instruments, clocks, lighters etc.
6. There is this spring (came from an analogue high current gauge) which I believe is gold leaf. however it's just a few mg weight.
7. x686 and a couple of fibre MMX with little gold plating on the pins.
Also about a 100 gr of other dental parts and jewelery, which I am not going to write more about since they hold a sentimental value, meaning there will be some time until I process them and IF...
I need also to mention that Pentium Pro Chips don't always weight 87,3gr. All these chips are in the order of 90gr. i.e. several I have weigh 88,8 etc. That could be another explanation why yields tend to vary significantly. The 512k cache PPro's seem to be 87,3, but there are 256k variants also. (k stands for kilobyte not karat) These variations indicate that since the ceramic packaging density and volume cannot change, the die and contacts should.Besides I don't think there is a chance that one can fine control the plating process, so it is more of a bet with processors and other computer components. The position of the cpu parts in the plating cell can't be the same from each terminal and the manufacturer couldn't be bothered. Just a speculation.
And now the questions:
1. Are there any known reactions between acids and ceramics?
2. Any lead and/or Cadmium present?
3. For pure gold such as no. 6 is it just better to melt it with the rest after dissolving in AR?
4. I have seen electrolytes contain cyanides and others with sulfuric acid and glycerine mix. I am not touching cyanides until the 2nd Coming (I prefer ordinary beans ), so the latter is prefferable. Do you know any other electrolyte compounds which are relatively safer?
Generally, am I on the right track?
Thanks for your input. It's much appreciated and I hope I could be of any help in the future.
I would like to post some thoughts just to see if they agree to a degree:
Most of the times I am using AC mask, gloves and glasses when stripping the components. I have set up a small spreadsheet, with weights, types etc. Up so far the scrap weighs about 1,5kg. I am not going to do much until I have gathered enough. Now what is enough is hard to tell, but I need to keep the gold acquiring process as a one time thing, perhaps two. It simply is more cost effective and less time consuming in the long run (confused? I know). For this, I suppose my best bet would be electrowinning.At least for the larger bulk. For small components I guess Aqua Regia is the way to go.
So here is what I have up so far:
1. a bag of various Gp connectors, boards, RAM modules etc.
2. 6 PPro Chips
3. 5 ICs in PGA package acquired from a 70's card.
4. GP pins from the same card, roughly removed.
5. Smaller particles from various instruments, clocks, lighters etc.
6. There is this spring (came from an analogue high current gauge) which I believe is gold leaf. however it's just a few mg weight.
7. x686 and a couple of fibre MMX with little gold plating on the pins.
Also about a 100 gr of other dental parts and jewelery, which I am not going to write more about since they hold a sentimental value, meaning there will be some time until I process them and IF...
I need also to mention that Pentium Pro Chips don't always weight 87,3gr. All these chips are in the order of 90gr. i.e. several I have weigh 88,8 etc. That could be another explanation why yields tend to vary significantly. The 512k cache PPro's seem to be 87,3, but there are 256k variants also. (k stands for kilobyte not karat) These variations indicate that since the ceramic packaging density and volume cannot change, the die and contacts should.Besides I don't think there is a chance that one can fine control the plating process, so it is more of a bet with processors and other computer components. The position of the cpu parts in the plating cell can't be the same from each terminal and the manufacturer couldn't be bothered. Just a speculation.
And now the questions:
1. Are there any known reactions between acids and ceramics?
2. Any lead and/or Cadmium present?
3. For pure gold such as no. 6 is it just better to melt it with the rest after dissolving in AR?
4. I have seen electrolytes contain cyanides and others with sulfuric acid and glycerine mix. I am not touching cyanides until the 2nd Coming (I prefer ordinary beans ), so the latter is prefferable. Do you know any other electrolyte compounds which are relatively safer?
Generally, am I on the right track?
Thanks for your input. It's much appreciated and I hope I could be of any help in the future.