The true name is Copper II Chloride etching solution but has also been called (AP) (acid peroxide solution) or also called Hydrochloric acid and 3% hydrogen peroxide solution (HCl /3% H202), and other names, It is used to etch copper circuit board traces when making circuits circuit boards for use in electronics circuits, very similar and replacement for to ferric chloride etching solution.
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When using copper II chloride solution to etch copper the volume of the solution grows as you use it, so I would start with just enough to cover material, you will either add air bubbles or 3%peroxide solution and HCl as copper I chloride forms, as you etch copper the volume increases of the solution as you rejuvenate it for use to dissolve more copper into solution.
If you have not studied the document on this solution I suggest anyone using it should it can be found on Laser Steve's web site (look for one of his post's for the link, if you have not visited his web site your missing some good information on this and other processes, Laser Steve was instrumental in adapting the copper leach solution to what we do here, reading his early posts on this subject can also give you a better understanding of its use here.
